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AS3658 Datasheet(PDF) 13 Page - ams AG |
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AS3658 Datasheet(HTML) 13 Page - ams AG |
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13 / 158 page  www.austriamicrosystems.com Revision 1v13 12 - 157 AS3658 Data Sheet Confidential - Absolute Maximum rati ngs 5 Absolute Maximum ratings Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical Characteristics on page 13 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 3. Absolute Maximum Ratings Parameter Min Max Unit Note High voltage pins (VIN_HV) -0.3 17.0 V Applicable for high voltage pins 1 1. HV pins VCHARGER, VGATE, VOFF_B, DCDC_CURR1, DCDC_CURR2, DCDC_CURR3 5V pins (VIN_MV) -0.3 7.0 V Applicable for pins 5V-pins 2 2. 5V pins are V_USB, CH_SENSE_N, CH_SENSE_P, VSUP_SW1, VSUP_SW2, VBAT_SW1, VBAT_SW2, V_BAT, SCL, SDA, XRESET, XINT, VSUPPLY_3, CURR1_GPIO1…CURR4_GPIO4, DCDC_GATE1, DCDC_GATE2, DCDC_SENSE_P1, DCDCSENSE_P2, DCDC_SENSE_N1, DCDC_SENSE_N2, DCDC_FB1, DCDC_FB2, VCL, VCP_OUT, VCP_N, VCP_P, VCP_IN, VCP_IN, VRF1, VREF1_IN, VRF2, VRF23_IN, VRF3, VDIG1, VDIG1_IN, VDIG2, VDIG2_IN, VDIG34_IN, VDIG_3, VDIG_4, PGATE1 VSUPPLY_1, VSUPPLY_2, LX1, LX2, GND_SW, VSUPPLY_4, LINE_CM, HP_CM_PWR, HP_CM, HPLx, HPRx, ALVDD, AVDD, LSP_R, BVSS, LSP_L, AVDD, VSUPPLY_5, VSUPPLY_6 3.3V pins (VIN_LV) -0.3 5.0 V Applicable for 3.3V-Pins 3 3. 3.3V pins are ISENSEP, ISENSEN, ADC_INx, RPROGRAM, V2_5, CREF, ON, VI2S, SDIx, SCLKx, MCLKx, LRCLKx, SDOx, SPDIF, AGND, VREF, LINL,LINR, VDAC, Q32K, XIN32, XOUT32, VBACK, MICS, MICN, MICP Input pin current (IIN) -25 +25 mA At 25 ºC, Norm: Jedec 78 Storage Temperature Range (Tstrg) -55 125 ºC Humidity 5 85 % Noncondens Electrostatic discharge 1kV (VESD) -1000 1000 V Norm: MIL 883 E Method 3015; Setup 4 Applicable for pins: all 4. The following pins are connected to ESD setup: VSUPPLY_1...VSUPPLY_6, VCP_IN, VRF1_IN, VRF2_IN, VCURR connected together VDIG1_IN, VDIG2_IN, VDIG34_IN connected together AVDD, ALVDD connected together VBAT_SW1 and VBAT_SW2 connected together VSUP_SW1 and VSUP_SW2 connected together All VSS connected together Total Power Dissipation 1W TA = 70ºC 0.72 W TA = 84ºC Package Body Temperature 260 °C IPC/JEDEC J-STD-020C, reflects moisture sensitivity level only The lead finish for Pb-free leaded packages is matte tin (100% Sn). Solder Profile 5 5. austriamicrosystems strongly recommends to use underfill. 235 245 °C TPEAK 30 45 s DWell, above 217 °C Moisture Sensitive Level 3 1 Represents a max. floor live time of 168h |
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