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CS5127 Datasheet(PDF) 24 Page - Cherry Semiconductor Corporation |
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CS5127 Datasheet(HTML) 24 Page - Cherry Semiconductor Corporation |
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24 / 24 page ![]() 24 Rev. 11/3/98 © 1999 Cherry Semiconductor Corporation 1.27 (.050) BSC 7.60 (.299) 7.40 (.291) 10.65 (.419) 10.00 (.394) D 0.32 (.013) 0.23 (.009) 1.27 (.050) 0.40 (.016) REF: JEDEC MS-013 2.49 (.098) 2.24 (.088) 0.51 (.020) 0.33 (.013) 2.65 (.104) 2.35 (.093) 0.30 (.012) 0.10 (.004) Package Specification PACKAGE DIMENSIONS IN mm (INCHES) PACKAGE THERMAL DATA Thermal Data 16 Lead SOIC Wide RQJC typ 23 ûC/W RQJA typ 105 ûC/W D Lead Count Metric English Max Min Max Min 16 Lead SOIC Wide 10.50 10.10 .413 .398 Ordering Information Part Number Description CS5127GDW16 16 Lead SOIC Wide CS5127GDWR16 16 Lead SOIC Wide (tape & reel) Surface Mount Wide Body (DW); 300mil wide Cherry Semiconductor Corporation reserves the right to make changes to the specifications without notice. Please contact Cherry Semiconductor Corporation for the latest available information. |
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