80960JD datasheet(65/86 Pages) INTEL

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80960JA/JF/JD/JS/JC/JT 3.3 V Embedded 32-Bit Microprocessor

Datasheet

Table 35. 80960JS/JC/JT 196-Ball MPBGA Package Thermal Characteristics

Thermal Resistance — °C/Watt

Parameter

Airflow — ft./min (m/sec)

(0)

200

(1.01)

400

(2.03)

600

(3.04)

800

(4.06)

1000

(5.08)

JC (Junction-to-Case)

222222

CA (Case-to-Ambient) (No Heatsink)

NOTES:

1. This table applies to an MPBGA device soldered directly into a board with all VSS connections.

θJA = θJC + θCA

Table 36. 132-Lead PQFP Package Thermal Characteristics

Thermal Resistance — °C/Watt

Parameter

Airflow — ft./min (m/sec)

(0)

(0.25)

100

(0.50)

200

(1.01)

400

(2.03)

600

(3.04)

800

(4.06)

JC (Junction-to-Case)

4.1

4.3

4.7

4.9

CA (Case-to-Ambient -No Heatsink)

NOTES:

1. This table applies to a PQFP device soldered directly into board.

θJA = θJC + θCA

θJL = 13° C/W (approx.)

θJB = 13.5° C/W (approx.)

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