80960JD datasheet(64/86 Pages) INTEL

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80960JA/JF/JD/JS/JC/JT 3.3 V Embedded 32-Bit Microprocessor

Datasheet

Table 33. 132-Lead PGA Package Thermal Characteristics

Thermal Resistance — °C/Watt

Parameter

Airflow — ft./min (m/sec)

(0)

200

(1.01)

400

(2.03)

600

(3.04)

800

(4.06)

1000

(5.08)

JC (Junction-to-Case)

0.7

CA (Case-to-Ambient) (No Heatsink)

CA (Case-to-Ambient) (Omnidirectional Heatsink)

96544

CA (Case-to-Ambient) (Unidirectional Heatsink)

86544

NOTES:

1. This table applies to a PGA device plugged into a socket or soldered directly into a board.

θJA = θJC + θCA

θJ-CAP = 5.6° C/W (approximate) (no heatsink)

θJ-PIN = 6.4° C/W (inner pins) (approximate) (no heatsink)

θJ-PIN = 6.2° C/W (outer pins) (approximate) (no heatsink)

θJ-CAP = 3° C/W (approximate) (with heatsink)

θJ-PIN = 3.3° C/W (inner pins) (approximate) (with heatsink)

θJ-PIN = 3.3° C/W (outer pins) (approximate) (with heatsink)

Table 34. 80960JA/JF/JD 196-Ball MPBGA Package Thermal Characteristics

Thermal Resistance — °C/Watt

Parameter

Airflow — ft./min (m/sec)

(0)

200

(1.01)

400

(2.03)

600

(3.04)

800

(4.06)

1000

(5.08)

JC (Junction-to-Case)

222222

CA (Case-to-Ambient) (No Heatsink)

NOTES:

1. This table applies to an MPBGA device soldered directly into a board with all VSS connections.

θJA = θJC + θCA

J-CAP

J-PIN

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