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DDC114IRTCRG3 Datasheet(PDF) 2 Page - Texas Instruments

Part # DDC114IRTCRG3
Description  Quad Current Input, 20-Bit Analog-To-Digital Converter
PDF  37 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

DDC114IRTCRG3 Datasheet(HTML) 2 Page - Texas Instruments

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DDC114
SBAS255C − JUNE 2004 − REVISED APRIL 2009
www.ti.com
2
PACKAGE/ORDERING INFORMATION
For the most current package and ordering information,
see the Package Option Addendum at the end of this
document, or see the TI website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS(1)
Analog Input Current
750
µA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AVDD to DVDD
−0.3V to +6V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AVDD to AGND
−0.3V to +6V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DVDD to DGND
−0.3V to +6V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AGND to DGND
±0.2V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VREF Input to AGND
2.0V to AVDD + 0.3V
. . . . . . . . . . . . . . . . . .
Analog Input to AGND
−0.3V to +0.7V
. . . . . . . . . . . . . . . . . . . . . . .
Digital Input Voltage to DGND
−0.3V to DVDD + 0.3V
. . . . . . . . . . .
Digital Output Voltage to DGND
−0.3V to AVDD + 0.3V
. . . . . . . . .
Operating Temperature
−40
°C to +85°C
. . . . . . . . . . . . . . . . . . . . . . .
Storage Temperature
−60
°C to +150°C
. . . . . . . . . . . . . . . . . . . . . . . .
Junction Temperature (TJ)
+150
°C
. . . . . . . . . . . . . . . . . . . . . . . . . . .
(1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not implied.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.



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