HDMP-1024 datasheet(22/40 Pages) HP

22 / 40 page

637

Mechanical Dimensions

and Surface Mount

Assembly

Recommendations

Both the HDMP-1022 and

HDMP-1024 are implemented in

an industry standard M-Quad 80

package. The package outline

dimensions conform to JEDEC

plastic QFP specifications and are

shown below in Figure 10. The

M-Quad 80 package material is

aluminum and the leads have

been formed into a “Gull-Wing”

configuration for surface

mounting.

Figure 10. Mechanical Dimensions of HDMP-1022 and HDMP-1024.

We recommend keeping the

package temperature, Tc, below

°C. Forced air cooling may be

required.

M-Quad 80 Package Information

Item

Details

Package Material

Aluminum

Lead Finish Material

85/15 Sn/Pb

Lead Finish Thickness

300 - 600

µ inches

Lead Coplanarity

0.004 inches maximum

PIN #1 ID

(0.779

+0.008

-0.002

(0.543 +0.008

-0.002

7 DEG

23.20 ± 0.10

(0.913 ± 0.004)

)

19.786

+0.18

-0.08

17.20 ± 0.10

(0.677 ± 0.004)

)

+0.16

-0.04

13.792

2.64 ± 0.13

(0.104 ± 0.005)

0.80 TYP.

(0.032 TYP.)

0.35 TYP.

(0.014 TYP.)

0.15

(0.006)

0.80 ± 0.13

(0.031 ± 0.00)

0.38 ± 0.05

(0.015 ± 0.002)

TOP VIEW

ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).

HDMP-1024 Datasheet(PDF) 22 Page - Agilent(Hewlett-Packard)

HDMP-1024 Datasheet(HTML) 22 Page - Agilent(Hewlett-Packard)

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