AN1703 - APPLICATION NOTE

9/22

The minimum recommended pad patterns for the single MOSFET SO-8 (figure 12a) and dual MOSFET

SO-8 (figure 12b) show the starting point for utilizing the board area available for the heat-spreading

copper. To create this pattern, a plane of copper overlies the drain pins.

Figure 12:Single (a) & dual MOSFET (b) SO-8 minimum recommended pad pattern (all dimensions

are in mm)

These connections provide planar copper to draw heat from the drain leads and start the process of

spreading the heat so it can be dissipated into the PCB. These patterns use all the available area

underneath the body for this purpose.

t

a

b

40

60

80

100

120

0

200

400

600

800

1000

1200

1400

1600

FR-4, 2 oz copper board

Minimum recommended footprint

Area