AN1703 - APPLICATION NOTE

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8. PowerFLAT™ (5x5) and PowerFLAT™ (6x5)

PowerFLAT, in both (5x5) and (6x5) versions, depending on the package body size in (mm x mm), allows

substantially bigger die capability with respect to the old-fashioned SO-8, still with reduced height and

weight. This in turn translates into a remarkable board space reduction. Furthermore, the lower profile

(1mm) allows higher operation frequency due to less inductance.

The leads are accommodated into the plastic body in such a way that a perfect co-planarity in assured.

Also a better thermal impedance is achieved by means of the exposed pad that provides a thermal path

from the die attached copper frame directly to the PCB.

The above features are exactly what designers demand in making their designs increasingly more

efficient.

Not only is the PowerFLAT (5x5) smaller, but it also differs from PowerFLAT (6x5) in the way the pads are

connected to the package. In fact, in PowerFLAT (5x5) the source terminals are on both sides while the

drain coincides with the exposed back metal side only. The PowerFLAT (6x5) case is pin to pin compatible

with a standard SO-8 package, it can house a larger die, and the exposed pad is connected to the drain

as well.

Figure 19: PowerFLAT (5x5) and PowerFLAT (6x5)

Figure 20 shows minimum recommended footprints for both types of PowerFLAT.

Figure 20:PowerFLAT (5x5) (a) and PowerFLAT (6x5) (b) minimum recommended footprints (all

dimension are in mm)

a

b