Copyright © 2015 Future Technology Devices International Limited

24

DS_FT600Q-FT601Q IC Datasheet/FT601 USB 3.0 to FIFO Bridge

Version 1.01

Document No.: FT_001118 Clearance No.: FTDI#424

8.3 QFN-76 Package Mechanical Dimensions

Figure 8.3 QFN-76 Package Dimensions

The FT601Q is supplied in a RoHS compliant leadless QFN-76 package. The package is lead ( Pb ) free,

and uses a ‘green’ compound. The package is fully compliant with European Union directive 2002/95/EC.

This package is nominally 9.0mm x 9.0mm body. The solder pads are on a 0.40mm pitch. The above

mechanical drawing shows the QFN-76 package.

The centre pad on the base of the FT601Q is internally connected to GND, the PCB should connect to

ground and not have signal tracking on the same layer as chip in this area.