AM4376 datasheet(118/261 Pages) TI

118 / 261 page

AM4376, AM4377, AM4378, AM4379

SPRS851B – JUNE 2014 – REVISED APRIL 2015

www.ti.com

Table 5-8. Thermal Resistance Characteristics (NFBGA Package) [ZDN]: –100 Speed Grade

over operating free-air temperature range (unless otherwise noted)

NAME

DESCRIPTION

ZDN

AIR FLOW

(°C/W)(1) (2)

(m/s)(1) (3)

ΘJC

Junction-to-case

7.07

ΘJB

Junction-to-board

11.11

ΘJA

Junction-to-free air

23.0

0.0

19.5

0.5

18.5

1.0

17.5

2.0

16.9

3.0

PsiJT

Junction-to-package top

2.10

0.0

2.16

0.5

2.20

1.0

2.27

2.0

2.31

3.0

PsiJB

Junction-to-board

11.59

0.0

11.18

0.5

11.05

1.0

10.91

2.0

10.80

3.0

(1)

These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [R

ΘJC] value, which is based on a

JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these

EIA/JEDEC standards:

•

JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

•

JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.

(2)

°C/W = degrees Celsius per watt.

(3)

m/s = meters per second.

118

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