AM4376 datasheet(117/261 Pages) TI

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AM4376, AM4377, AM4378, AM4379

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SPRS851B – JUNE 2014 – REVISED APRIL 2015

5.10 Thermal Characteristics

Failure to maintain a junction temperature within the range specified in Section 5.5 reduces operating lifetime,

reliability, and performance—and may cause irreversible damage to the system. Therefore, the product design

cycle should include thermal analysis to verify the maximum operating junction temperature of the device. It is

important this thermal analysis is performed using specific system use cases and conditions. TI provides an

application report to aid users in overcoming some of the existing challenges of producing a good thermal

design. For more information, see AM43xx Thermal Considerations.

Table 5-7 and Table 5-8 provide thermal characteristics for the packages used on this device.

NOTE

These tables provide simulation data and may not represent actual use-case values.

Table 5-7. Thermal Resistance Characteristics (NFBGA Package) [ZDN]: –80 Speed Grade

over operating free-air temperature range (unless otherwise noted)

NAME

DESCRIPTION

ZDN

AIR FLOW

(°C/W)(1) (2)

(m/s)(1) (3)

ΘJC

Junction-to-case

6.46

ΘJB

Junction-to-board

10.34

ΘJA

Junction-to-free air

22.4

0.0

18.8

0.5

17.7

1.0

16.7

2.0

16.2

3.0

PsiJT

Junction-to-package top

1.33

0.0

1.39

0.5

1.44

1.0

1.51

2.0

1.56

3.0

PsiJB

Junction-to-board

10.80

0.0

10.38

0.5

10.26

1.0

10.12

2.0

10.02

3.0

(1)

These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [R

ΘJC] value, which is based on a

JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these

EIA/JEDEC standards:

•

JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

•

JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.

(2)

°C/W = degrees Celsius per watt.

(3)

m/s = meters per second.

Specifications

117

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