LP38859 datasheet(4/25 Pages) TI

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LP38859

SNVS337F – JUNE 2006 – REVISED SEPTEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VIN supply voltage (survival)

−0.3

VBIAS supply voltage (survival)

−0.3

VSS soft-start voltage (survival)

−0.3

VOUT voltage (survival)

−0.3

IOUT current (survival)

Internally limited

Power dissipation(3)

Internally limited

Junction temperature

150

°C

Storage temperature, Tstg

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, contact the TI Sales Office/ Distributors for availability and specifications.

(3)

Device power dissipation must be de-rated based on device power dissipation (PD), ambient temperature (TA), and package junction to

ambient thermal resistance (RθJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not

exceed the maximum operating rating. See the Application and Implementation section for details.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN supply voltage

(VOUT + VDO)

VBIAS

VBIAS supply voltage

5.5

IOUT

Junction temperature(1)

−40

125

°C

(1)

Device power dissipation must be de-rated based on device power dissipation (PD), ambient temperature (TA), and package junction to

ambient thermal resistance (RθJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not

exceed the maximum operating rating. See the Application and Implementation section for details.

6.4 Thermal Information

LP38859

THERMAL METRIC(1)

KTT (DDPAK/TO-263

NDH (TO-220)

UNIT

5 PINS

RθJA

Junction-to-ambient thermal resistance

43.2

70.7(2)

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

43.5

43.0

°C/W

RθJB

Junction-to-board thermal resistance

23.1

n/a(2)

°C/W

ψJT

Junction-to-top characterization parameter

11.6

23.6(2)

°C/W

ψJB

Junction-to-board characterization parameter

22.0

52.2(2)

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

1.1

1.3

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

The NDH (TO-220) package is vertically mounted in center of JEDEC High-K test board (JESD 51-7) with no additional heat sink. This is

a through-hole package; this is NOT a surface mount package.

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