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LM2585 Datasheet(PDF) 6 Page - Texas Instruments |
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LM2585 Datasheet(HTML) 6 Page - Texas Instruments |
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6 / 32 page ![]() LM2585 SNVS120F – APRIL 2000 – REVISED APRIL 2013 www.ti.com Electrical Characteristics (All Versions) (continued) Symbol Parameters Conditions Typical Min Max Units θJA DDPAK/TO-263 Package, 26 Junction to Ambient(9) θJC DDPAK/TO-263 Package, 2 Junction to Case (9) Junction to ambient thermal resistance for the 5 lead TO-263 mounted horizontally against a PC board copper area of 1.0064 square inches (7.4 times the area of the DDPAK/TO-2633 package) of 1 oz. (0.0014 in. thick) copper. Additional copper area will reduce thermal resistance further. See the thermal model in Switchers Made Simple™ software. 6 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2585 |
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