TUSB3210PM datasheet(6/50 Pages) TI1

6 / 50 page

TUSB3210

SLLS466G – FEBRUARY 2001 – REVISED DECEMBER 2015

www.ti.com

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VCC

Supply voltage

–0.5

Input voltage

–0.5

VCC + 0.5

Output voltage

–0.5

VCC + 0.5

IIK

Input clamp current

±20

IOK

Output clamp current

±20

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V(ESD)

Electrostatic discharge

Charged-device model (CDM), per JEDEC specification JESD22-

±500

C101(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

VCC

Supply voltage

3.3

3.6

Input voltage

VCC

VIH

High-level input voltage

VCC

VIL

Low-level input voltage

0.8

Operating temperature

°C

6.4 Thermal Information

TUSB3210

THERMAL METRIC(1)

PM (LQFP)

UNIT

64 PINS

RθJA

Junction-to-ambient thermal resistance

61.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

25.1

°C/W

RθJB

Junction-to-board thermal resistance

32.4

°C/W

ψJT

Junction-to-top characterization parameter

2.4

°C/W

ψJB

Junction-to-board characterization parameter

32.1

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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