L9662 datasheet(17/80 Pages) STMICROELECTRONICS

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L9662

Electrical specifications

tisrcshtdwn

Time after voltage threshold

crossed for squib pin to

shutdown

IISRC

Guaranteed by design

μs

VLSDrsqb

Voltage threshold on squib

pin to shutdown ISRC

0.8

2.2

tR_WAIT

Rmeas wait time 6

Wait time before AOUT

voltage is stable for ADC

reading

300

μs

FENx Input pins

tFENfilter

Minimum pulse width

μs

IFENPD

Internal pull-down current

VIN = VIL to VDD

μA

VFENLO

Input low voltage threshold

0.8

VFENHI

Input high voltage threshold

2.0

TFENLATCH FEN Latch timer

512

tFLACC

FEN latch timer

accuracy

- 20%

Deployment drivers

TRESOLUTION Diagnostic timing / resolution Guaranteed by design,

IHS ≥ IMEAS,

0s ≤ TMEASURE_TIME ≤ 3.7 ms

CSQUIB _HI = 0.12 μF

CSQUIB _LO = 0.12 μF

22.5

27.5

μs

TACCURACY

Diagnostic timing

accuracy

LSB

IMEAS

High side driver current limit

detect threshold

Guaranteed by design

IHSX x

0.90

IHSX x

0.99

Vbreakdown

HS or LS breakdown

voltage

Voltage across driver = 40 V

μA

RDSonTOTAL

Total high and low side MOS

on resistance

High side MOS +

low side MOS D9:D8=”11”;

VRES = 7 V; I = 1.6A @95 °C

2.0

RDSonHS

High side MOS on resistance D9:D8=”11”; VRES = 7 V;

IVRES = 1.6 A;

0.3

0.8

RDSonLS

Low side MOS on resistance

0.6

1.2

Table 7. Squib deployment drivers and diagnostics - DC electrical characteristics

Symbol

Parameter

Test condition

Min.

Typ.

Max.

Unit

L9662 Datasheet(PDF) 17 Page - STMicroelectronics

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