TUSB1210 datasheet(6/66 Pages) TI1

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TUSB1210

SLLSE09H – NOVEMBER 2009 – REVISED JUNE 2015

www.ti.com

Specifications

4.1

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VCC

Main battery supply voltage (2)

Where supply represents the voltage applied

Voltage on any input(3)

to the power supply pin associated with the

–0.3

1 × VCC +0.3

input

VBUS input

–2

ID, DP, DM inputs

Stress condition guaranteed 24h

–0.3

5.25

VDDIO

IO supply voltage

Continuous

1.98

Ambient temperature range

–40

°C

Absolute maximum rating

–40

150

Ambient temperature range

°C

For parametric compliance

–40

125

Ambient temperature for parametric

With max 125°C as junction temperature

–40

°C

compliance

DP, DM or ID pins short circuited to VBUS

DP, DM, ID high voltage short circuit

supply, in any mode of TUSB1210 operation,

5.25

continuously for 24 hours

DP, DM or ID pins short circuited to GND in

DP, DM, ID low voltage short circuit

any mode of TUSB1210 operation,

continuously for 24 hours

Tstg

Storage temperature range

–55

125

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Section 4.3 is not implied.

Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The product will have negligible reliability impact if voltage spikes of 5.5 V occur for a total (cumulative over lifetime) duration of 5

milliseconds.

(3)

Except VBAT input, VBUS, ID, DP, and DM pads

4.2

ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS001(1)

±2

Electrostatic discharge (ESD)

V(ESD)

performance:

Charged device model (CDM), per JESD22-C101(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

4.3

Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VBAT

Battery supply voltage

2.7

3.6

4.8

VBAT

When VDD33 is supplied internally

3.15

Battery supply voltage for USB 2.0 compliancy

CERT

(USB 2.0 certification)

When VDD33 is shorted to VBAT externally

3.05

VDDIO

Digital IO pin supply

1.71

1.98

Ambient temperature range

–40

°C

4.4

Thermal Information

PARAMETER

MEASUREMENT METHOD

VALUE

UNIT

θJA

Junction-to-ambient thermal resistance

EIA/JESD 51-1

34.72

°C/W

θJC top

Junction-to-case top thermal resistance(1)

No current JEDEC specification(2)

37.3

°C/W

(1)

Top is surface of the package facing away from the PCB.

(2)

Refer to measurement method in Chapter 2 of IC Package Thermal Metrics (SPRA953).

Specifications

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