TUSB1210 datasheet(7/66 Pages) TI1

7 / 66 page

TUSB1210

www.ti.com

SLLSE09H – NOVEMBER 2009 – REVISED JUNE 2015

Thermal Information (continued)

PARAMETER

MEASUREMENT METHOD

VALUE

UNIT

θJC

Junction-to-case bottom thermal resistance(3)

No current JEDEC specification(2)

3.6

°C/W

bottom

θJB

Junction-to-board thermal resistance or junction-

EIA/ JESD 51-8.

10.3

°C/W

to-pin thermal resistance

ΨJT

Junction-to-top of package (not a true thermal

EIA/JESD 51-2

0.5

°C/W

resistance)

ΨJB

Junction-to-board (not a true thermal resistance)

EIA/JESD 51-6

10.5

°C/W

(3)

Bottom surface is the surface of the package facing towards the PCB.

4.5

Power Consumption

Table 4-1 describes the power consumption depending on the use cases.

NOTE

The typical power consumption is obtained in the nominal operating conditions and with the

TUSB1210 standalone.

Table 4-1. Power Consumption

TYPICAL

MODE

CONDITIONS

SUPPLY

UNIT

CONSUMPTION

IVBAT

IVDDIO

VBAT = 3.6 V, VDDIO = 1.8 V, VDD18

OFF Mode

µA

= 1.8 V, CS = 0 V

IVDD18

ITOTAL

IVBAT

204

IVDDIO

VBUS = 5 V, VBAT = 3.6 V, VDDIO =

Suspend Mode

µA

1.8 V, No clock

IVDD18

ITOTAL

210

IVBAT

24.6

IVDDIO

1.89

HS USB Operation

VBAT = 3.6 V, VDDIO = 1.8 V, VDD18

(Synchronous Mode)

= 1.8 V, active USB transfer

IVDD18

21.5

ITOTAL

IVBAT

25.8

IVDDIO

1.81

FS USB Operation

VBAT = 3.6 V, VDDIO = 1.8 V, active

(Synchronous Mode)

USB transfer

IVDD18

4.06

ITOTAL

31.7

IVBAT

237

IVDDIO

RESETB = 0 V, VBUS = 5 V, VBAT

Reset Mode

µA

= 3.6 V, VDDIO = 1.8 V, No clock

IVDD18

ITOTAL

243

Specifications

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