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ML7066 Datasheet(PDF) 26 Page - LAPIS Semiconductor Co., Ltd. |
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ML7066 Datasheet(HTML) 26 Page - LAPIS Semiconductor Co., Ltd. |
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26 / 29 page ![]() FEDL7066-01 ML7066 26/29 Package Information Recommended PCB Layout Reference Diagram Recommended Land Pattern [Unit: mm] When designing the land pattern of the mounting board, you should give due consideration to ease of mounting, reliability of connection, wiring, and no solder bridging. The optimal design of the land pattern depends on the board material, solder type, thickness, and soldering method. This material shall be used for reference only when designing the land pattern. |
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