| Electronic Components Datasheet Search |
|
MICRF230 Datasheet(PDF) 11 Page - Micrel Semiconductor |
|
|
|||||||||||||||||||||||||||||
MICRF230 Datasheet(HTML) 11 Page - Micrel Semiconductor |
|
11 / 20 page ![]() Micrel, Inc. MICRF230 ASK/OOK Demodulator The demodulator section is comprised of detector, programmable low pass filter, slicer, and AGC comparator. Detector and Programmable Low-Pass Filter The demodulation starts with the detector removing the carrier from the IF signal. Post detection, the signal becomes baseband information. The low-pass filter further enhances the baseband signal. There are four selectable low-pass filter BW settings: 1625Hz, 3250Hz, 6500Hz and 13000Hz for 433.92MHz operation. The low-pass filter BW is directly proportional to the crystal reference frequency, and RF Operating Frequency. Filter BW values can be easily calculated by direct scaling. Equation 5 illustrates filter Demod BW calculation: BWOperating Freq = BW@433.92MHz × 433.92 (MHz) Freqruency Operating Eq. 5 It is very important to select a suitable low-pass filter BW setting for the required data rate to minimize bit error rate. Use the sensitivity curves that show BER vs. bit rates for different SEL0:SEL1 settings as a guide. This low-pass filter with −3dB corner frequency bandwidth can be configured by setting the registers as in Table 1 for 433.92MHz. Table 1. Low-Pass Filter Bandwidth Selection @ 434MHz RF Input SEL1 SEL0 Low-Pass Filter BW Maximum Encoded Bit Rate 0 0 1625Hz 2.5KBps 0 1 3250Hz 5KBps 1 0 6500Hz 10KBps 1 1 13000Hz 20KBps Bit rate refers to the encoded bit rate. Encoded bit rate is 1/(shortest pulse duration) that appears at DO: Figure 3. Transmitted Bit Rate through the air Slicer and CTH The signal before the slicer, labeled “Audio Signal” in Figure 1, is still a baseband analog signal. The data slicer converts the analog signal into ones and zeros based on 50% of the slicing threshold voltage built up in the CTH capacitor. After the slicer, the signal is demodulated OOK digital data. When there is only thermal noise at ANT pin, the voltage level on CTH pin is about 650mV. This voltage starts to drop when there is RF signal present. When the RF signal level is greater than −100dBm, the voltage is about 400mV. The capacitor value from the CTH pin to GND is not critical to the sensitivity of MICRF230. However, it should be large enough to provide a stable slicing level for the comparator. The 0.1μF value used in the evaluation board is good for all bit rates from 500bps to 20kbps. CTH Hold Mode If the internal demodulated signal (DO in Figure 1) is at logic LOW for more than approximately 4ms, the chip automatically enters CTH hold mode, which holds the voltage on CTH pin constant even without a RF input signal. This is useful in a transmission gap, or “dead time”, used in many encoding schemes. When the signal reappears, CTH voltage does not need to resettle. This improves the time to output with no pulse width distortion, or time to good data (TTGD). AGC Loop The AGC comparator monitors the signal amplitude from the output of the programmable low-pass filter. The AGC loop in the chip regulates the signal from the output point to be at a constant level when the input RF signal is within the AGC loop dynamic range (about −115dBm to −40dBm). When the chip first turns on, the fast charge feature charges the AGC node up with 120µA typical current. When the voltage on AGC increases, the gains of the mixer and IF amplifier go up, increasing the amplitude of the audio signal (as labeled in Figure 1), even with only thermal noise at the LNA input. The fast-charge current is disabled when the audio signal crosses the slicing threshold, causing DO’ to go high, for the first time. When an RF signal is applied, a fast-attack period ensues when 600µA current discharges the AGC node to reduce the gain to a proper level. Once the loop reaches equilibrium, the fast attack current is disabled, leaving only 15µA to discharge AGC or 1.5µA to charge AGC. The fast attack current is enabled only when the RF signal increases faster than the ability of the AGC loop to track it. The ability of the chip to track to a signal that decreased in strength becomes much slower, since only 1.5 μA is available to charge the AGC to increase the gain. When designing a transmitter that communicates with the April 15, 2015 11 Revision 2.0 |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |