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LAN88730 Datasheet(PDF) 35 Page - Microchip Technology

Part # LAN88730
Description  Small Footprint MII/RMII 10/100 Ethernet Transceiver for Automotive Applications
PDF  82 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

LAN88730 Datasheet(HTML) 35 Page - Microchip Technology

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2012-2015 Microchip Technology Inc.
DS60001256B-page 35
LAN88730
The COL may be tested by setting the Collision Test bit of the Basic Control Register to “1”. This enables the collision
test. COL will be asserted within 512 bit times of TXEN rising and will be de-asserted within 4 bit times of TXEN falling.
3.8.8
LINK INTEGRITY TEST
The device performs the link integrity test as outlined in the IEEE 802.3u (clause 24-15) Link Monitor state diagram. The
link status is multiplexed with the 10 Mbps link status to form the Link Status bit in the Basic Status Register and to drive
the LINK LED (LED1).
The DSP indicates a valid MLT-3 waveform present on the RXP and RXN signals as defined by the ANSI X3.263 TP-
PMD standard, to the Link Monitor state-machine, using the internal DATA_VALID signal. When DATA_VALID is
asserted, the control logic moves into a Link-Ready state and waits for an enable from the auto-negotiation block. When
received, the Link-Up state is entered, and the Transmit and Receive logic blocks become active. Should auto-negoti-
ation be disabled, the link integrity logic moves immediately to the Link-Up state when the DATA_VALID is asserted.
To allow the line to stabilize, the link integrity logic will wait a minimum of 330 ms from the time DATA_VALID is asserted
until the Link-Ready state is entered. Should the DATA_VALID input be negated at any time, this logic will immediately
negate the Link signal and enter the Link-Down state.
When the 10/100 digital block is in 10BASE-T mode, the link status is derived from the 10BASE-T receiver logic.



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