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LAN88730 Datasheet(PDF) 76 Page - Microchip Technology

Part # LAN88730
Description  Small Footprint MII/RMII 10/100 Ethernet Transceiver for Automotive Applications
PDF  82 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

LAN88730 Datasheet(HTML) 76 Page - Microchip Technology

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LAN88730
DS60001256B-page 76
 2012-2015 Microchip Technology Inc.
APPENDIX A: REVISION HISTORY
REVISION LEVEL
& DATE
SECTION/FIGURE/ENTRY
CORRECTION
Revision B
(09-08-15)
• Added Product Identification System
• Changed ‘QFN’ to ‘VQFN’
Chapter 2, "Pin Description and Config-
uration"
• Figure 2-1: rotated 90° cw
Section 5.8, "Clock Circuit"
Added new 100 µW crystal specifications and circuit
diagram. The section is now split into two
subsections, one for 300 µW crystals and the other
for 100 µW crystals.
Chapter 6, "Package Outline"
Updated package outline drawing information
Revision A
(12-11-13)
Replaces the previous SMSC version Rev. 1.1
Removed confidentiality from document
Added Note and Trademark page
Added Worldwide Sales and Services page
Changed order numbers
Chapter 2, "Pin Description and
Configuration"
Table 2-3, “Serial Management Interface (SMI)
Pins”: Changed “VIS/VOD8 (PU)” to “VIS/VO8 (PU)”
Section 4.1, "Register Nomenclature"
Table 4-1, “Register Bit Types”, register bit
description for byte type notification ‘W’: Changed
“Read” to ‘Write”
Section 5.7.5, "RMII Interface Timing"
Updated RMII timing table: Updated REF_CLK In
mode toval max from “14.0 ns” to “15.0 ns”
Rev. 1.1
(12-10-12)
Cover
• Added new bullet under Highlights section:
“Deterministic 100 Mb internal loopback latency
(MII Mode)”
• Changed “Integrated 1.2 V regulator with dis-
able feature” to “Integrated 1.2 V regulator”
Section 1.2, "General Description"
• Removed: “The linear regulator may be option-
ally disabled, allowing usage of a high efficiency
external regulator for lower system power dissi-
pation.”
Chapter 2, "Pin Description and
Configuration"
• Figure 2-1: Removed “REGOFF” from Pin 3
• Table 2-1, “MII/RMII Signals”: Changed buffer
type from “VIS (PU)” to “VIS”
• Table 2-2, “LED Pins”: Removed “REGOFF”
• Table 2-3, “Serial Management Interface (SMI)
Pins”: Added pull-up to MDIO buffer type
description
• Table 2-7, “Power Pins”: Removed “unless con-
figured for regulator off mode via the REGOFF
configuration strap.”
• Table 2-8, “32-VQFN Package Pin Assign-
ments”: Removed “REGOFF”
Section 3.3, "HP Auto-MDIX Support"
Changed “100BASE-T” to “100BASE-TX”
Section 3.4.2.1, "CRS_DV - Carrier
Sense/Receive Data Valid"
Changed “100BASE-X” to “100BASE-TX”
Section 3.7, "Configuration Straps"
• Removed Section “REGOFF”
• Changed note from “When externally ... except
for REGOFF and nINTSEL ... to VDD2A.” to
“When externally ... except for nINTSEL ... to
VDD2A.”



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