LAN88730 datasheet(74/82 Pages) MICROCHIP

74 / 82 page

LAN88730

DS60001256B-page 74

 2012-2015 Microchip Technology Inc.

Microchip Technology Drawing C04-232A Sheet 2 of 2

Number of Terminals

Overall Height

Terminal Width

Terminal Length

Mold Cap Height

Pitch

Standoff

Units

Dimension Limits

0.50 BSC

0.65

0.30

0.18

0.80

0.00

0.23

0.40

0.85

0.02

MILLIMETERS

MIN

NOM

0.50

0.30

0.90

0.05

MAX

K-

0.25

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package is punch singulated

Dimensioning and tolerancing per ASME Y14.5M

Terminal-to-Exposed-Pad

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Overall Width

Overall Length

Exposed Pad Width

Exposed Pad Length

3.20

5.00 BSC

3.30

5.00 BSC

3.40

Mold Cap Width

Mold Cap length

4.75 BSC

3.20

3.30

3.40

0.70

0.60

Chamfer

0.24

0.42

0.60

Mold Draft Angle

0°

14°

Terminal Thickness

(A3)

0.20 REF

32-Lead Very Thin Plastic Quad Flat, No Lead Package (RN) - 5x5 mm Body [VQFN]

With 3.3x3.3 mm Exposed Pad, Punch Singulated; Formerly called QFN

LAN88730 Datasheet(PDF) 74 Page - Microchip Technology

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