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AD5675R Datasheet(PDF) 28 Page - Analog Devices

Part # AD5675R
Description  Easy implementation
PDF  28 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

AD5675R Datasheet(HTML) 28 Page - Analog Devices

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Data Sheet
AD5676
Rev. B | Page 27 of 27
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-153-AC
20
1
11
10
6.40 BSC
4.50
4.40
4.30
PIN 1
6.60
6.50
6.40
SEATING
PLANE
0.15
0.05
0.30
0.19
0.65
BSC
1.20 MAX
0.20
0.09
0.75
0.60
0.45
8°
0°
COPLANARITY
0.10
Figure 52. 20-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-20)
Dimensions shown in millimeters
0.50
BSC
0.50
0.40
0.30
0.30
0.25
0.18
COMPLIANT
TO JEDEC STANDARDS MO-220-WGGD.
BOTTOM VIEW
TOP VIEW
EXPOSED
PAD
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
0.25 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
2.75
2.60 SQ
2.35
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
1
20
6
10
11
15
16
5
Figure 53. 20-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.75 mm Package Height
(CP-20-8)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Resolution
Temperature
Range
Accuracy
Package Description
Package
Option
AD5676ARUZ
16 Bits
−40°C to +125°C
±8 LSB INL
20-Lead Thin Shrink Small Outline Package [TSSOP]
RU-20
AD5676ARUZ-REEL7
16 Bits
−40°C to +125°C
±8 LSB INL
20-Lead Thin Shrink Small Outline Package [TSSOP]
RU-20
AD5676BRUZ
16 Bits
−40°C to +125°C
±3 LSB INL
20-Lead Thin Shrink Small Outline Package [TSSOP]
RU-20
AD5676BRUZ-REEL7
16 Bits
−40°C to +125°C
±3 LSB INL
20-Lead Thin Shrink Small Outline Package [TSSOP]
RU-20
AD5676ACPZ-REEL7
16 Bits
−40°C to +125°C
±8 LSB INL
20-Lead Lead Frame Chip Scale Package [LFCSP]
CP-20-8
AD5676ACPZ-RL
16 Bits
−40°C to +125°C
±8 LSB INL
20-Lead Lead Frame Chip Scale Package [LFCSP]
CP-20-8
AD5676BCPZ-REEL7
16 Bits
−40°C to +125°C
±3 LSB INL
20-Lead Lead Frame Chip Scale Package [LFCSP]
CP-20-8
AD5676BCPZ-RL
16 Bits
−40°C to +125°C
±8 LSB INL
20-Lead Lead Frame Chip Scale Package [LFCSP]
CP-20-8
EVAL-AD5676SDZ
Evaluation Board
1
Z = RoHS Compliant Part.
I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
©2014–2015 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D12549-0-10/15(B)



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