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PCF26100 Datasheet(PDF) 20 Page - NXP Semiconductors

Part # PCF26100
Description  Bluetooth Adapter IC
PDF  28 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

PCF26100 Datasheet(HTML) 20 Page - NXP Semiconductors

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2001 Jun 19
20
Philips Semiconductors
Preliminary specification
Bluetooth Adapter IC
PCF26100
8
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
9
DC CHARACTERISTICS
Notes
1. VDDA should be supplied from a stable source.
2. Standby power consumption is measured when SYS_CLK_REQ = 0.
SYMBOL
DESCRIPTION
MIN.
MAX.
UNIT
VDD
core supply voltage
VSS − 0.5
VSS + 3.6
V
VDDA
analog supply voltage
VSS − 0.5
VSS + 3.6
V
VDD(I/O)
I/O supply voltage
VSS − 0.5
VSS + 3.6
V
VDD(osc)
oscillator supply voltage
VSS − 0.5
VSS + 3.6
V
Vin
input voltage
VSS − 0.5
VDD + 0.3
V
Tstg
storage temperature
−50
+150
°C
Toper
operating temperature
0
+70
°C
SYMBOL
DESCRIPTION
MIN.
TYP.
MAX.
UNIT
VDD
core supply voltage
2.7
3.0 to 3.3
3.6
V
VDDA
analog supply voltage for ADC and DAC; note 1
2.7
3.0 to 3.3
3.6
V
VDD(I/O)
I/O supply voltage
2.7
3.0 to 3.3
3.6
V
VDD(osc)
oscillator supply voltage
2.7
3.0 to 3.3
3.6
V
Ptx
transmit power consumption
−
22
−
mW
Prx
receive power consumption
−
14
−
mW
Pstb
standby power consumption; note 2
−
3
−
mW
VIL
LOW-level input voltage
−0.5
−
+0.3VDD(I/O)
V
VIH
HIGH-level input voltage
0.7VDD(I/O)
−
VDD + 0.3
V
VOL
LOW-level output voltage
−−
0.5
V
VOH
HIGH-level output voltage
2.4
−−
V
ILI
input leakage current
−10
−
+10
µA



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