2001 Jun 19

24

Philips Semiconductors

Preliminary specification

Bluetooth Adapter IC

PCF26100

12 PACKAGE OUTLINE

0.5

A1

b

A2

UNIT

D

y

e

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

00-10-10

IEC

JEDEC

EIAJ

mm

1.12

0.28

0.16

0.84

0.76

5.1

4.9

y1

5.1

4.9

0.37

0.27

0.12

DIMENSIONS (mm are the original dimensions)

SOT641-1

MO-211

E

0.15

0.1

e1

3.5

v

0.1

w

0

2.5

5 mm

scale

SOT641-1

TFBGA48: plastic thin fine-pitch ball grid array package; 48 balls; body 5 x 5 x 0.8 mm

A

max.

A

A2

A1

detail X

y

y1 C

e

e

b

X

D

E

C

M

A

B

C

D

E

F

H

G

2468

1357

B

A

M

vA

M

vB

e1

e1

ball A1

index area