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MP2636 Datasheet(PDF) 39 Page - Monolithic Power Systems

Part # MP2636
Description  3.0A Single Cell Switch Mode Battery Charger with Power Path Management (PPM) and 3.0A System Boost Current
PDF  40 Pages
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Manufacturer  MPS [Monolithic Power Systems]
Direct Link  http://www.monolithicpower.com
Logo MPS - Monolithic Power Systems

MP2636 Datasheet(HTML) 39 Page - Monolithic Power Systems

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MP2636 –3.0A SINGLE CELL SW MODE BATTERY CHARGER WITH PPM AND 3.0A BOOST
MP2636 Rev.1.01
www.MonolithicPower.com
39
5/1/2018
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2018 MPS. All Rights Reserved.
noise, efficiency and stability requirements. The
following design considerations can improve
circuit performance:
1) Route the power stage adjacent to their
grounds. Aim to minimize the high-side switching
node (SW, inductor) trace lengths in the high-
current paths.
Keep the switching node short and away from all
small control signals, especially the feedback
network.
Place the input capacitor as close as possible to
the VIN and PGND pins. The local power input
capacitors, connected from the SYS to PGND,
must be placed as close as possible to the IC.
Place the output inductor close to the IC and
connect
the
output
capacitor
between
the
inductor and PGND of the IC.
2) For high-current applications, the power pads
for IN, SYS, SW, BATT and PGND should be
connected to as many coppers planes on the
board
as
possible.
This
improves
thermal
performance because the board conducts heat
away from the IC.
3) The PCB should have a ground plane
connected directly to the return of all components
through vias (e.g., two vias per capacitor for
power-stage capacitors, one via per capacitor for
small-signal components). A star ground design
approach is typically used to keep circuit block
currents
isolated
(power-signal/control-signal),
which
reduces
noise-coupling
and
ground-
bounce issues. A single ground plane for this
design gives good results.
4) Place ISET, OLIM and ILIM resistors very
close to their respective IC pins.
GND
SYS
BATT
GND
AGND
VIN
IB
SW
SYS
VIN
VCC
ILIM
PWIN
TMR
BOOST
SW
SYS
VIN
CSP
BATT
VB
AGND
SYS
VIN
Figure 15: PCB Layout Guide



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