OPA521 datasheet(4/22 Pages) TI1

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OPA521

SBOS872 – MAY 2018

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage, V+

Pins 1, 20

GND + 26

Signal input terminals

Voltage

Pins 7, 8, 9, 12

GND – 0.4

V+ +

0.4

Pins 11, 15

GND – 0.4

5.5

Current

Pins 7, 8, 9, 11, 12, 15

±10

Signal output terminals

Voltage

Pins 18, 19

GND – 0.4

V+ +

0.4

Pins 13, 14

GND – 0.4

5.5

Current; short-circuit to GND

Pins 13, 14, 18, 19

Continuous

Operating temperature, TA

–40

150

°C

Operating junction temperature, TJ

–55

150

°C

Storage temperature, Tstg

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±3000

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2)

±500

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.3 Thermal Information

THERMAL METRIC(1)

OPA521

UNIT

RGW (QFN)

20 PINS

RθJA

Junction-to-ambient thermal resistance

33.7

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

30.4

°C/W

RθJB

Junction-to-board thermal resistance

12.5

°C/W

ΨJT

Junction-to-top characterization parameter

0.5

°C/W

ΨJB

Junction-to-board characterization parameter

12.5

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

2.5

°C/W

6.4

Electrical Characteristics

at TCASE = 25°C, V+ = 15 V, IN+ = (V+) / 2, RLOAD 50 Ω, (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

NOISE

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