6

RF Device Data

NXP Semiconductors

MMRF2010N MMRF2010GN

Figure 5. MMRF2010N Reference Circuit Component Layout — 1030–1090 MHz

* Stacked components

Note: Component numbers C2, C3, C4, and C5 are not used.

C23

R1

R2

C26

C24

C19

C18

C20

C17

C11

C13*

C14*

C15*

C16*

C12

C21

C6

C8

C9

C7

C22

Q1

Rev. B

C1

C26

C25

C10

Table 8. MMRF2010N Reference Circuit Component Designations and Values — 1030–1090 MHz

Part

Description

Part Number

Manufacturer

C1, C10

56 pF Chip Capacitors

ATC600F560JT250XT

ATC

C11, C12, C17, C18,

C19

51 pF Chip Capacitors

ATC600F510JT250XT

ATC

C6, C7

10 pF Chip Capacitors

ATC600F100JT250XT

ATC

C8

6.8 pF Chip Capacitor

ATC600F6R8BT250XT

ATC

C9

2.4 pF Chip Capacitor

ATC600F2R4BT250XT

ATC

C13, C14, C15, C16,

C25, C26

10 μF Chip Capacitors

C5750X7S2A106M

TDK

C20

1 μF Chip Capacitor

GRM21BR71H105KA12L

Murata

C21, C22

8.2 pF Chip Capacitors

ATC600F8R2BT250XT

ATC

C23

2.7 pF Chip Capacitor

ATC600F2R7BT250XT

ATC

C24

1.5 pF Chip Capacitor

ATC600F1R5BT250XT

ATC

Q1

RF Power LDMOS Transistor

MMRF2010N

NXP

R1

3.9 kΩ, 1/16 W Chip Resistor

RR0816P-392-B-T5

Susumu

R2

1kΩ, 1/16 W Chip Resistor

RR0816P-102-B-T5

Susumu

PCB

—

MTL