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AD5767 Datasheet(PDF) 11 Page - Analog Devices

Part # AD5767
Description  16-Channel, 16-Bit/12-Bit Voltage Output denseDACs
PDF  43 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

AD5767 Datasheet(HTML) 11 Page - Analog Devices

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Data Sheet
AD5766/AD5767
Rev. C | Page 11 of 43
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. Transient currents of up to
100 mA do not cause silicon controlled rectifier (SCR) latch-up.
Table 5.
Parameter
Rating
AVDD to AGND
−0.3 V to +34 V
AVSS to AGND
+0.3 V to −34 V
AVDD to AVSS
−0.3 V to +34 V
AVCC to AGND
−0.3 V to +7 V
AVCC to AGND
−0.3 V to AVDD + 0.3 V
VLOGIC to DGND
−0.3 V to +7 V
Digital Inputs1 to DGND
−0.3 V to VLOGIC + 0.3 V
Digital Output (SDO) to DGND
−0.3 V to VLOGIC + 0.3 V
N0, N1 to AGND
−0.3 V to AVCC + 0.3 V
VREF to AGND
−0.3 V to AVCC + 0.3 V
VOUTx to AGND
AVSS − 0.3 V to AVDD + 0.3 V
AGND to DGND
−0.3 V to +0.3 V
Operating Temperature Range,
TA Industrial
−40°C to +105°C
Storage Temperature Range
−65°C to +150°C
Junction Temperature, TJ MAX
150°C
Power Dissipation
(TJ MAX − TA)/θJA
Lead Temperature
Soldering Reflow
260°C, as per JEDEC J-STD-020
1
The digital inputs include RESET, SCLK, SYNC, and SDI.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
θJA is the natural convection junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure.
Table 6. Thermal Resistance
Package Type
θJA
Unit
CB-49-41
53
°C/W
CP-40-71
31.71
°C/W
1
Thermal impedance simulated values are based on JEDEC 2S2P thermal test
board with 16 thermal vias. See JEDEC JESD51.
ESD CAUTION



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