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AD5767 Datasheet(PDF) 11 Page - Analog Devices |
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AD5767 Datasheet(HTML) 11 Page - Analog Devices |
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11 / 43 page ![]() Data Sheet AD5766/AD5767 Rev. C | Page 11 of 43 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Transient currents of up to 100 mA do not cause silicon controlled rectifier (SCR) latch-up. Table 5. Parameter Rating AVDD to AGND −0.3 V to +34 V AVSS to AGND +0.3 V to −34 V AVDD to AVSS −0.3 V to +34 V AVCC to AGND −0.3 V to +7 V AVCC to AGND −0.3 V to AVDD + 0.3 V VLOGIC to DGND −0.3 V to +7 V Digital Inputs1 to DGND −0.3 V to VLOGIC + 0.3 V Digital Output (SDO) to DGND −0.3 V to VLOGIC + 0.3 V N0, N1 to AGND −0.3 V to AVCC + 0.3 V VREF to AGND −0.3 V to AVCC + 0.3 V VOUTx to AGND AVSS − 0.3 V to AVDD + 0.3 V AGND to DGND −0.3 V to +0.3 V Operating Temperature Range, TA Industrial −40°C to +105°C Storage Temperature Range −65°C to +150°C Junction Temperature, TJ MAX 150°C Power Dissipation (TJ MAX − TA)/θJA Lead Temperature Soldering Reflow 260°C, as per JEDEC J-STD-020 1 The digital inputs include RESET, SCLK, SYNC, and SDI. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL RESISTANCE Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. θJA is the natural convection junction to ambient thermal resistance measured in a one cubic foot sealed enclosure. Table 6. Thermal Resistance Package Type θJA Unit CB-49-41 53 °C/W CP-40-71 31.71 °C/W 1 Thermal impedance simulated values are based on JEDEC 2S2P thermal test board with 16 thermal vias. See JEDEC JESD51. ESD CAUTION |
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