USB97C201 datasheet(57/59 Pages) SMSC

57 / 59 page

SMSC DS – USB97C201

Page 57

Rev. 03/25/2002

PRELIMINARY

9.0 PACKAGING

FIGURE 6 - 100 PIN TQFP PACKAGE

MIN

NOMINAL

MAX

REMARK

1.60

Overall Package Height

0.05

0.15

Standoff

1.35

1.40

1.45

Body Thickness

13.80

14.00

14.20

X Span

D/2

6.90

7.00

7.10

2 X Span Measure from Centerline

11.80

12.00

12.20

X body Size

13.80

14.00

14.20

Y Span

E/2

6.90

7.00

7.10

2 Y Span Measure from Centerline

11.80

12.00

12.20

Y body Size

0.09

0.20

Lead Frame Thickness

0.45

0.60

0.75

Lead Foot Length from Centerline

1.00

Lead Length

0.40 Basic

Lead Pitch

3.5

Lead Foot Angle

0.13

0.16

0.23

Lead Width

0.08

Lead Shoulder Radius

0.08

0.20

Lead Foot Radius

ccc

0.08

Coplanarity

Notes:

Note 1: Controlling Unit: millimeter

Note 2: Minimum space between protrusion and an adjacent lead is .007 mm.

Note 3: Package body dimensions D1 and E1 do not include the mold protrusion. Maximum mold protrusion is 0.25

Note 5: Details of pin 1 identifier are optional but must be located within the zone indicated.

USB97C201 Datasheet(PDF) 57 Page - SMSC Corporation

USB97C201 Datasheet(HTML) 57 Page - SMSC Corporation

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