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AD5940 Datasheet(PDF) 17 Page - Analog Devices

Part # AD5940
Description  High Precision, Impedance, and Electrochemical Front End
PDF  130 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

AD5940 Datasheet(HTML) 17 Page - Analog Devices

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Data Sheet
AD5940
Rev. 0 | Page 17 of 130
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Rating
AVDD to AGND
−0.3 V to +3.6 V
DVDD to DGND
−0.3 V to +3.6 V
IOVDD to DGND
−0.3 V to +3.6 V
Analog Input Voltage to AGND
−0.3 V to AVDD +0.3V
Digital Input Voltage to DGND
−0.3 V to DVDD +0.3V
Digital Output Voltage to DGND
−0.3 V to DVDD +0.3V
AGND to DGND
−0.3 V to +0.3 V
Total GPIOx Pins Current
Positive
0 mA to 30 mA
Negative
−30 mA to 0 mA
Storage Temperature Range
−65°C to +150°C
Operating Temperature Range
−40°C to +85°C
Reflow Profile
Moisture Sensitivity Level 3 (MSL3)
J-STD 020E (JEDEC)
Junction Temperature
150°C
Electrostatic Discharge (ESD)
Human Body Model (HBM)
2 kV
Field Induced Charged Device
Model (FICDM)
1 kV
Machine Model (MM)
100 V
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Close attention to
PCB thermal design is required.
θJA is the natural convection junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure.
θJC is the junction to case thermal resistance.
Table 6. Thermal Resistance1
Package Type
θJA
θJC
Unit
CB-56-3
33.0702
0.0642
°C/W
1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal test board. See
JEDEC JESD51.
ESD CAUTION



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