7

ISO7021

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SLLSFA0 – JULY 2019

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

ISO7021

UNIT

D (SOIC)

8 PINS

Junction-to-ambient thermal resistance

94.3

°C/W

Junction-to-case (top) thermal resistance

28.6

°C/W

Junction-to-board thermal resistance

43.6

°C/W

Junction-to-top characterization parameter

2.3

°C/W

Junction-to-board characterization parameter

42.9

°C/W

Junction-to-case (bottom) thermal resistance

—

°C/W

7.5 Power Ratings

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Maximum power dissipation (both sides)

15 pF, Input a 2-MHz 50% duty cycle

square wave

8.4

mW

Maximum power dissipation (side-1)

4.2

mW

Maximum power dissipation (side-2)

4.2

mW