2004 May 05

21

Philips Semiconductors

Preliminary specification

Power stage 2 x 10 or 1 x 20 W class-D

audio amplifier

TDA8928J

17 SOLDERING

17.1

Introduction to soldering through-hole mount

packages

This text gives a brief insight to wave, dip and manual

soldering. A more in-depth account of soldering ICs can be

found in our

“Data Handbook IC26; Integrated Circuit

Packages” (document order number 9398 652 90011).

Wave soldering is the preferred method for mounting of

through-hole mount IC packages on a printed-circuit

board.

17.2

Soldering by dipping or by solder wave

Driven by legislation and environmental forces the

worldwide use of lead-free solder pastes is increasing.

Typical dwell time of the leads in the wave ranges from

3 to 4 seconds at 250

°C or 265 °C, depending on solder

material applied, SnPb or Pb-free respectively.

The total contact time of successive solder waves must not

exceed 5 seconds.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature within the permissible limit.

17.3

Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the

package, either below the seating plane or not more than

2 mm above it. If the temperature of the soldering iron bit

is less than 300

°C it may remain in contact for up to

10 seconds. If the bit temperature is between

300 and 400

°C, contact may be up to 5 seconds.

17.4

Suitability of through-hole mount IC packages for dipping and wave soldering methods

Notes

1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

2. For PMFP packages hot bar soldering or manual soldering is suitable.

PACKAGE

SOLDERING METHOD

DIPPING

WAVE

CPGA, HCPGA

−

suitable

DBS, DIP, HDIP, RDBS, SDIP, SIL

suitable

suitable(1)

PMFP(2)

−

not suitable