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PR533 Datasheet(PDF) 8 Page - NXP Semiconductors |
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PR533 Datasheet(HTML) 8 Page - NXP Semiconductors |
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8 / 36 page ![]() PR533_SDS All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product short data sheet COMPANY PUBLIC Rev. 3.6 — 27 October 2014 206436 8 of 36 NXP Semiconductors PR533 USB NFC integrated reader solution 8. Recommended operating conditions [1] VSSA, VDDD and VDD(TVDD) shall always be on the same voltage level. [2] Supply voltages below 3 V reduces the performance (e.g. the achievable operating distance). 9. Thermal characteristics 10. Characteristics Unless otherwise specified, the limits are given for the full operating conditions. The typical value is given for 25 C, V DDD = 3.4 V and VDD(PVDD) = 3 V in non-USB bus power mode, VBUS = 5 V in USB power mode. Timings are only given from characterization results. 10.1 Power management characteristics 10.1.1 Current consumption characteristics Typical value using a complementary driver configuration and an antenna matched to 40 between TX1 and TX2 at 13.56 MHz. Table 5. Operating conditions Symbol Parameter Conditions Min Typ Max Unit VBUS bus supply voltage VSSA = VSSD = VSS(PVSS) = VSS(TVSS) = 0 V 4.02 5 5.25 V supply voltage (non-USB mode); VBUS = VDDD; VSSA = VSSD = VSS(PVSS) = VSS(TVSS) = 0 V 2.53.3 3.6V VDDA analog supply volt- age VDDA = VDDD = VDD(TVDD) = VDD(PVDD); VSSA =VSSD = VSS(PVSS) = VSS(TVSS) = 0 V [1][2] 2.53.3 3.6V VDDD digital supply volt- age VDDA = VDDD = VDD(TVDD) = VDD(PVDD); VSSA =VSSD = VSS(PVSS) = VSS(TVSS) = 0 V [1][2] 2.53.3 3.6V VDD(TVDD) TVDD supply volt- age VDDA = VDDD = VDD(TVDD) = VDD(PVDD); VSSA =VSSD = VSS(PVSS) = VSS(TVSS) = 0 V [1][2] 2.53.3 3.6V VDD(PVDD) PVDD supply volt- age supply pad for host interface; VDDA =VDDD =VDD(TVDD) = VDD(PVDD); VSSA =VSSD = VSS(PVSS) = VSS(TVSS) = 0 V [2] 1.6 1.8 to 3.3 3.6 V Tamb ambient tempera- ture 30 +25 +85 C Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-a) thermal resistance from junction to ambient in free air with exposed pad soldered on a 4 layer Jedec PCB-0.5 -37 41.1 K/W |
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