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SA614AD Datasheet(PDF) 28 Page - NXP Semiconductors |
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SA614AD Datasheet(HTML) 28 Page - NXP Semiconductors |
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28 / 28 page ![]() NXP Semiconductors SA614A Low power FM IF system © NXP B.V. 2014. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 14 February 2014 Document identifier: SA614A Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Functional description . . . . . . . . . . . . . . . . . . . 5 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 Thermal characteristics . . . . . . . . . . . . . . . . . . 6 10 Static characteristics . . . . . . . . . . . . . . . . . . . . . 6 11 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 12 Performance curves . . . . . . . . . . . . . . . . . . . . . 8 13 Application information. . . . . . . . . . . . . . . . . . . 9 13.1 Circuit description . . . . . . . . . . . . . . . . . . . . . . 10 13.2 IF amplifiers . . . . . . . . . . . . . . . . . . . . . . . . . . 11 13.3 Stability considerations . . . . . . . . . . . . . . . . . 13 13.4 Quadrature detector . . . . . . . . . . . . . . . . . . . . 14 13.5 Frequency discriminator design equations . . . 15 13.6 Audio outputs . . . . . . . . . . . . . . . . . . . . . . . . . 16 13.7 RSSI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 13.8 Additional circuitry . . . . . . . . . . . . . . . . . . . . . 17 14 Test information . . . . . . . . . . . . . . . . . . . . . . . . 18 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20 16 Soldering of SMD packages . . . . . . . . . . . . . . 22 16.1 Introduction to soldering . . . . . . . . . . . . . . . . . 22 16.2 Wave and reflow soldering . . . . . . . . . . . . . . . 22 16.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 22 16.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 23 17 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 24 18 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 25 19 Legal information. . . . . . . . . . . . . . . . . . . . . . . 26 19.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 26 19.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 19.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 19.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 27 20 Contact information. . . . . . . . . . . . . . . . . . . . . 27 21 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 |
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