SA614A

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© NXP B.V. 2014. All rights reserved.

Product data sheet

Rev. 4 — 14 February 2014

4 of 28

NXP Semiconductors

SA614A

Low power FM IF system

6.2 Pin description

[1]

HXQFN16 package supply ground is connected to both GND pin and exposed center pad. GND pin must

be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board

level performance, the exposed pad must be soldered to the board using a corresponding thermal pad on

the board. For proper heat conduction through the board, thermal vias must be incorporated in the PCB in

the thermal pad region.

Table 2.

Pin description

Symbol

Pin

Description

SO16

HXQFN16

IF_AMP_DECOUPL

1

14

IF amplifier decoupling

GND

2

15

ground

MUTE_INPUT

3

16

mute input

4

1

supply voltage

RSSI_OUTPUT

5

2

RSSI output

MUTE_AUD_OUTP

6

3

mute audio output

UNMUTE_AUD_OUTP

7

4

unmute audio output

QUADRATURE_INPUT

8

5

quadrature input

LIMITER_OUTPUT

9

6

limiter output

LIMITER_DECOUPL

10

7

limiter decoupling

LIMITER_DECOUPL

11

8

limiter decoupling

LIMITER_INPUT

12

9

limiter input

GND

13

10[1]

ground

IF_AMP_OUTPUT

14

11

IF amplifier output

IF_AMP_DECOUPL

15

12

IF amplifier decoupling

IF_AMP_INPUT

16

13

IF amplifier input

-

-

DAP

exposed Die Attach Paddle