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AMC7823 Datasheet(PDF) 2 Page - Texas Instruments |
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AMC7823 Datasheet(HTML) 2 Page - Texas Instruments |
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2 / 48 page ![]() www.ti.com DESCRIPTION (CONTINUED) ABSOLUTE MAXIMUM RATINGS AMC7823 SLAS453A – APRIL 2005 – REVISED OCTOBER 2005 The AMC7823 has an internal programmable reference (+2.5 V or +1.25 V), and an SPI serial interface. An external reference can be used as well. Typical power dissipation is 100 mW. The analog input range is 0 V to +5 V, and the analog output range is 0 V to +2.5 V or 0 V to +5 V. The AMC7823 is ideal for multichannel applications where low power and small size are critical. The AMC7823 is available in a 40-lead QFN package and is fully specified over the –40°C to +85°C temperature range. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) PACKAGE- SPECIFIED LEAD TEMPERATURE PACKAGE ORDERING TRANSPORT PRODUCT (DESIGNATOR) RANGE MARKING NUMBER MEDIA, QUANTITY AMC7823 AMC7823IRTAT Tape and Reel, 250 AMC7823 QFN-40 (RTA) –40°C to 85°C AMC7823 AMC7823IRTAR Tape and Reel, 2000 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Over operating free-air temperature range unless otherwise noted((1)) AMC7823 UNIT AVDD, DVDD, BVDD to GND –0.3 to +6 V Digital input voltage to GND –0.3 to BVDD + 0.3 V Analog input voltage to GND –0.3 to AVDD + 0.3 V Input current, continuous ±20 mA Input current, momentary ±100 mA Operating temperature range –40 to +105 °C Storage temperature range –65 to +150 °C Junction temperature range (TJ max) +150 °C Power dissipation (TJ max – TA) / θJA W Thermal impedance, θ JC 15 °C/W Thermal impedance, θ JA 60 °C/W Lead temperature (soldering) Vapor phase (60s) +215 °C Lead temperature (soldering) Infrared (15s) +220 °C (1) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. 2 |
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