MPC5777C datasheet(2/90 Pages) NXP

2 / 90 page

Table of Contents

1 Introduction...............................................................................3

1.1

Features summary..........................................................3

1.2

Block diagram..................................................................4

2 Pinouts......................................................................................5

2.1

416-ball MAPBGA pin assignments................................5

2.2

516-ball MAPBGA pin assignments................................6

3 Electrical characteristics............................................................7

3.1

Absolute maximum ratings..............................................7

3.2

Electromagnetic interference (EMI) characteristics.........9

3.3

Electrostatic discharge (ESD) characteristics.................9

3.4

Operating conditions.......................................................9

3.5

DC electrical specifications.............................................12

3.6

I/O pad specifications......................................................13

3.6.1

Input pad specifications..................................13

3.6.2

Output pad specifications...............................15

3.6.3

I/O pad current specifications.........................19

3.7

Oscillator and PLL electrical specifications.....................19

3.7.1

PLL electrical specifications...........................20

3.7.2

Oscillator electrical specifications..................21

3.8

Analog-to-Digital Converter (ADC) electrical

specifications...................................................................23

3.8.1

Enhanced Queued Analog-to-Digital

Converter (eQADC)........................................23

3.8.2

Sigma-Delta ADC (SDADC)...........................25

3.9

Temperature Sensor.......................................................34

3.10 LVDS Fast Asynchronous Serial Transmission (LFAST)

pad electrical characteristics...........................................34

3.10.1

LFAST interface timing diagrams...................34

3.10.2

LFAST and MSC/DSPI LVDS interface

electrical characteristics.................................36

3.10.3

LFAST PLL electrical characteristics.............39

3.11 Power management: PMC, POR/LVD, power

sequencing......................................................................40

3.11.1

Power management electrical characteristics40

3.11.2

Power management integration.....................43

3.11.3

Device voltage monitoring..............................44

3.11.4

Power sequencing requirements....................46

3.12 Flash memory specifications...........................................47

3.12.1

Flash memory program and erase

specifications..................................................48

3.12.2

Flash memory Array Integrity and Margin

Read specifications........................................48

3.12.3

Flash memory module life specifications.......49

3.12.4

Data retention vs program/erase cycles.........50

3.12.5

Flash memory AC timing specifications.........50

3.12.6

Flash memory read wait-state and address-

pipeline control settings..................................51

3.13 AC timing.........................................................................52

3.13.1

Generic timing diagrams................................52

3.13.2

Reset and configuration pin timing.................53

3.13.3

IEEE 1149.1 interface timing..........................54

3.13.4

Nexus timing..................................................57

3.13.5

External Bus Interface (EBI) timing................59

3.13.6

External interrupt timing (IRQ/NMI pin)..........63

3.13.7

eTPU timing...................................................64

3.13.8

eMIOS timing.................................................65

3.13.9

DSPI timing with CMOS and LVDS pads.......66

3.13.10

FEC timing.....................................................78

4 Package information.................................................................83

4.1

Thermal characteristics...................................................83

4.1.1

General notes for thermal characteristics......84

5 Ordering information.................................................................87

6 Document revision history.........................................................88

MPC5777C Microcontroller Data Sheet Data Sheet, Rev. 14, 01/2020.

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