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MPC5777C Datasheet(PDF) 13 Page - NXP Semiconductors |
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MPC5777C Datasheet(HTML) 13 Page - NXP Semiconductors |
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13 / 90 page ![]() Table 4. DC electrical specifications (continued) Symbol Parameter Conditions Value Unit Min Typ Max ISTBY Standby RAM supply current 1.08 V, TJ = 150°C — — 1140 μA 1.25 V to 5.5 V, TJ = 150°C 1170 1.25 V to 5.5 V, TJ = 85°C 360 1.25 V to 5.5 V, TJ = 40°C — — 120 IDD_PWR Operating current on the VDDPWR supply — — — 50 mA IBG_REF Bandgap reference current consumption3 — — 600 μA ITRNG True Random Number Generator current — — — 2.1 mA 1. IDD measured on an application-specific pattern with all cores enabled at full frequency, TJ = 40°C to 150°C. Flash memory program/erase current on the VDD supply not included. 2. This value is considering the use of the internal core regulator with the simulation of an external transistor with the minimum value of hFE of 60. 3. This bandgap reference is for EQADC calibration and Temperature Sensors. 3.6 I/O pad specifications The following table describes the different pad types on the chip. Table 5. I/O pad specification descriptions Pad type Description General-purpose I/O pads General-purpose I/O and EBI data bus pads with four selectable output slew rate settings; also called SR pads EBI pads Provide necessary speed for fast external memory interfaces on the EBI CLKOUT, address, and control signals; also called FC pads LVDS pads Low Voltage Differential Signal interface pads Input-only pads Low-input-leakage pads that are associated with the ADC channels NOTE Each I/O pin on the device supports specific drive configurations. See the signal description table in the device reference manual for the available drive configurations for each I/O pin. NOTE Throughout the I/O pad specifications, the symbol VDDEx represents all VDDEx and VDDEHx segments. Electrical characteristics MPC5777C Microcontroller Data Sheet Data Sheet, Rev. 14, 01/2020. NXP Semiconductors 13 |
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