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LT8335 Datasheet(PDF) 7 Page - Analog Devices |
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LT8335 Datasheet(HTML) 7 Page - Analog Devices |
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7 / 20 page ![]() LT8338 7 Rev. 0 For more information www.analog.com TYPICAL PERFORMANCE CHARACTERISTICS Load Step Response (Pulse-Skipping Mode) Load Step Response (Burst Mode Operation) 1ms/DIV 8338 G19 ILOAD 100mA/DIV IL 500mA/DIV VOUT 200mV/DIV VINTVCC 20mV/DIV 1ms/DIV 8338 TPC20 ILOAD 100mA/DIV IL 500mA/DIV VOUT 500mV/DIV VINTVCC 20mV/DIV PIN FUNCTIONS VIN (Pin 1): Input Supply Pin. Bypass this pin to GND with a low ESR ceramic capacitor of 0.1µF or greater. Place the capacitor as close to the pin as possible. BST (Pin 2): Top Switch Gate Driver Supply Pin. Tie a 0.1µF capacitor between BST and SW as close as possible to the pins to keep the trace length short. SW (Pins 3, 4): Switch Node. Connect this pin to inductor, and to the boost capacitor. SW is a high dV/dt node that should be kept as compact as possible and away from high impedance nodes. VOUT (Pin 5): Output Voltage Pin. Bypass this pin to GND with a low ESR ceramic capacitor of 4.7µF or greater. Place the capacitor as close to the pin as possible. Additional capacitance as required by specific applications must be similarly closely placed. See the Applications and Physical Layout sections for details. An 18:1 internal resistive voltage divider provides feedback sensing of the output voltage to the error amplifier. SYNC/MODE (Pin 6): External Synchronization Input and Light Load Operation Mode Selection Pin. This pin allows five selectable modes for optimization of performance. SYNC/MODE PIN INPUT CAPABLE MODE(S) OF OPERATION (1) GND or <0.14V Burst (2) 100k Resistor to GND Burst/SSFM (3) Float (Pin Open) Pulse-Skipping (4) INTVCC or >2.0V Pulse-Skipping/SSFM (5) External Clock Pulse-Skipping/SYNC where the selectable modes of operation are: Burst = Low IQ, low output ripple operation at light loads Pulse-Skipping = Skipped pulse(s) at light load (aligned to clock) SYNC = Switching frequency synchronized to external clock SSFM = Spread Spectrum Frequency Modulation for low EMI RT (Pin 7): Switching Frequency Set Pin. Set the switch- ing frequency with a resistor between this pin and GND. Do not leave this pin open. In frequency synchronization mode, use a resistor RT to program the frequency the same as the synchronization signal. EN/UVLO (Pin 8): Enable and Input Undervoltage Lockout Pin. The LT8338 is shut down when this pin is below 1V (typ), and is enabled when this pin is above 1.05V (typ). A resistor divider from VIN to GND pro- grams a VIN threshold below which the LT8338 is shut down. Tying this pin to GND shuts down operation and reduces quiescent supply current to 0.2µA (max). Tie to VIN if the shutdown feature is not used. CTRL (Pin 9): Reference Input Pin. Tie the tap point of a resistive voltage divider between INTVCC and GND to this pin to set the error amplifier reference input to 1/18 of the desired system output voltage. INTVCC (Pin 10): Internal 2.6V Regulator Pin. Bypass this pin to GND with a low ESR ceramic capacitor of 2.2µF or greater. Place the capacitor as close to the pin as possible. Set the output voltage (VOUT) by program- ming the CTRL pin voltage via a resistive voltage divider between INTVCC and GND. Use a minimum total resis- tance of 1M to keep the divider’s contribution to the VIN quiescent current to 2.6µA in shut down. GND (Pin 11): Ground Pin. Connect this pin to system ground and to the ground plane to achieve the best ther- mal performance. |
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