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LT8335 Datasheet(PDF) 7 Page - Analog Devices

Part # LT8335
Description  40V, 1.2A Micropower Synchronous Boost Converter with PassThru
PDF  20 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

LT8335 Datasheet(HTML) 7 Page - Analog Devices

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LT8338
7
Rev. 0
For more information www.analog.com
TYPICAL PERFORMANCE CHARACTERISTICS
Load Step Response
(Pulse-Skipping Mode)
Load Step Response
(Burst Mode Operation)
1ms/DIV
8338 G19
ILOAD
100mA/DIV
IL
500mA/DIV
VOUT
200mV/DIV
VINTVCC
20mV/DIV
1ms/DIV
8338 TPC20
ILOAD
100mA/DIV
IL
500mA/DIV
VOUT
500mV/DIV
VINTVCC
20mV/DIV
PIN FUNCTIONS
VIN (Pin 1): Input Supply Pin. Bypass this pin to GND with
a low ESR ceramic capacitor of 0.1µF or greater. Place the
capacitor as close to the pin as possible.
BST (Pin 2): Top Switch Gate Driver Supply Pin. Tie a 0.1µF
capacitor between BST and SW as close as possible to the
pins to keep the trace length short.
SW (Pins 3, 4): Switch Node. Connect this pin to inductor,
and to the boost capacitor. SW is a high dV/dt node that
should be kept as compact as possible and away from high
impedance nodes.
VOUT (Pin 5): Output Voltage Pin. Bypass this pin to GND
with a low ESR ceramic capacitor of 4.7µF or greater. Place
the capacitor as close to the pin as possible. Additional
capacitance as required by specific applications must be
similarly closely placed. See the Applications and Physical
Layout sections for details. An 18:1 internal resistive
voltage divider provides feedback sensing of the output
voltage to the error amplifier.
SYNC/MODE (Pin 6): External Synchronization Input and
Light Load Operation Mode Selection Pin. This pin allows
five selectable modes for optimization of performance.
SYNC/MODE PIN INPUT
CAPABLE MODE(S) OF OPERATION
(1) GND or <0.14V
Burst
(2) 100k Resistor to GND
Burst/SSFM
(3) Float (Pin Open)
Pulse-Skipping
(4) INTVCC or >2.0V
Pulse-Skipping/SSFM
(5) External Clock
Pulse-Skipping/SYNC
where the selectable modes of operation are:
Burst = Low IQ, low output ripple operation at light loads
Pulse-Skipping = Skipped pulse(s) at light load (aligned to clock)
SYNC = Switching frequency synchronized to external clock
SSFM = Spread Spectrum Frequency Modulation for low EMI
RT (Pin 7): Switching Frequency Set Pin. Set the switch-
ing frequency with a resistor between this pin and GND.
Do not leave this pin open. In frequency synchronization
mode, use a resistor RT to program the frequency the
same as the synchronization signal.
EN/UVLO (Pin 8): Enable and Input Undervoltage
Lockout Pin. The LT8338 is shut down when this pin is
below 1V (typ), and is enabled when this pin is above
1.05V (typ). A resistor divider from VIN to GND pro-
grams a VIN threshold below which the LT8338 is shut
down. Tying this pin to GND shuts down operation and
reduces quiescent supply current to 0.2µA (max). Tie to
VIN if the shutdown feature is not used.
CTRL (Pin 9): Reference Input Pin. Tie the tap point of
a resistive voltage divider between INTVCC and GND to
this pin to set the error amplifier reference input to 1/18
of the desired system output voltage.
INTVCC (Pin 10): Internal 2.6V Regulator Pin. Bypass
this pin to GND with a low ESR ceramic capacitor of
2.2µF or greater. Place the capacitor as close to the pin
as possible. Set the output voltage (VOUT) by program-
ming the CTRL pin voltage via a resistive voltage divider
between INTVCC and GND. Use a minimum total resis-
tance of 1M to keep the divider’s contribution to the VIN
quiescent current to 2.6µA in shut down.
GND (Pin 11): Ground Pin. Connect this pin to system
ground and to the ground plane to achieve the best ther-
mal performance.



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