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FXLS8967AF Datasheet(PDF) 80 Page - NXP Semiconductors

Part # FXLS8967AF
Description  3-Axis Low-g Accelerometer
PDF  98 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

FXLS8967AF Datasheet(HTML) 80 Page - NXP Semiconductors

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NXP Semiconductors
FXLS8967AF
3-Axis Low-g Accelerometer
16 Application information
16.1 System connections
FXLS8967AF connects to a host processor through an I2C or SPI interface. Figure 19 to
Figure 24 show the recommended circuit connections.
16.2 Typical application circuits
X7R or X5R ceramic capacitors are recommended for VDD supply decoupling. A 1 µF
capacitor in parallel with a 0.1 µF is recommended as a starting point per the NXP EMC
test standard. These capacitors should be placed as close to the VDD supply pin as
practical. The values of the capacitors can be changed to suit the EMC performance
requirements of the application.
aaa-040829
R4
C2
1.0 µF
C1
0.1 µF
R1
R2
1
2
3
4
5
10
9
8
7
6
VDD
VDD
VDD
BT_MODE
GND
INTF_SEL
INT1/MOT_DET
SPI_CS_B/WAKE_UP
INT2/EXT_TRIG/BOOT_OUT
INT1
WAKE_UP
INT2/EXT_TRIG
SA0/SPI_MISO
I2C_SA0
I2C_SDA
I2C_SCL
SDA/SPI_MOSI
SCL/SCLK
R3
Figure 19. Typical Application Circuit #1 – I2C mode
Notes:
• Resistors R1 and R2 are not needed if the interrupt output driver type is configured for
push-pull operation (default).
• If either the INT1 or INT2 pins are not used in the application, leave them unconnected.
• The required pull-up resistor values for R3 and R4 are dependent on several factors
including the I2C clock frequency, bus pull-up voltage, and the total parasitic trace
+ device capacitances. A suggested starting point is 4.7 kΩ for Standard and Fast
modes.
• The external trigger function can be used to initiate a single shot measurement of
the XYZ acceleration and temperature data. This mode is useful for synchronizing
measurements with an external system or for creating user-specific ODRs. The
measurement is triggered on the rising edge of the EXT_TRIG signal.
aaa-040830
C1
0.1 µF
R1
R2
1
2
3
4
5
10
9
8
7
6
VDD
VDD
VDD
BT_MODE
GND
INTF_SEL
INT1/MOT_DET
SPI_CS_B/WAKE_UP
INT2/EXT_TRIG/BOOT_OUT
INT1
WAKE_UP
INT2/EXT_TRIG
SA0/SPI_MISO
MOSI
MISO
SCLK
SDA/SPI_MOSI/SPI_DATA
SCL/SCLK
C2
1.0 µF
Figure 20. Typical Application Circuit #2 – SPI 4-wire mode
FXLS8967AF
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2021. All rights reserved.
Objective data sheet
Rev. 1 — 27 April 2021
80 / 98



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