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AT45DB021E Datasheet(PDF) 68 Page - Dialog Semiconductor

Part # AT45DB021E
Description  2-Mbit DataFlash (with Extra 64 kbits) 1.65 V Minimum SPI Serial Flash Memory
PDF  74 Pages
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Manufacturer  DIALOG [Dialog Semiconductor]
Direct Link  http://www.dialog-semiconductor.com/
Logo DIALOG - Dialog Semiconductor

AT45DB021E Datasheet(HTML) 68 Page - Dialog Semiconductor

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AT45DB021E
DS-AT45DB021E—8789J—03/2021
28.3 Ordering Codes (Binary Page Mode)
Notes: 1. The shipping carrier suffix is not marked on the device.
2. Parts ordered with suffix code ‘2B’ are shipped in tape and reel (T&R) with the page size set to 256 bytes.
This option is only available for shipping in T&R (-T).
3. Contact Dialog Semiconductor for availability.
28.4 Ordering Codes (Reserved)
Notes: 1. The shipping carrier suffix is not marked on the device.
2. Parts ordered with suffix code ‘HA’ are shipped in tape and reel (T&R) only with the page size set to 264
bytes.
3. Parts ordered with suffix code ‘HC’ are shipped in tape and reel (T&R) only with the page size set to 256
bytes.
Contact Dialog Semiconductor for a description of these ‘Reserved’ codes.
Ordering Code
Package
Lead Finish
Operating Voltage
fSCK
Device Grade
AT45DB021E-SSHN2B-T 1,2
8S1
NiPdAu
1.65 V to 3.6 V
70 MHz
Industrial
(-40
°C to 85°C)
AT45DB021E-SHN2B-T 1,2
8S2
AT45DB021E-MHN2B-T 1,2
8MA1
AT45DB021E-UUN2B-T 1,2,3
CS2-8A
Package
Code
Description
8S1
8-lead 0.150" wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8S2
8-lead 0.208" wide, Plastic Gull Wing Small Outline (EIAJ SOIC)
8MA1
8-pad (5 x 6 x 0.6 mm body), Thermally Enhanced Plastic Ultra Thin Dual Flat No-lead (UDFN)
CS2-8A
8-ball 1.9 x 1.4 mm Wafer Level Chip Scale Package
DWF
Die in Wafer Form
Ordering Code
Package
Lead Finish
Operating Voltage
fSCK
Device Grade
AT45DB021E-SSHNHA-T 1,2
8S1
NiPdAu
1.65 V to 3.6 V
70 MHz
Industrial
(-40
°C to 85°C)
AT45DB021E-SHNHA-T 1,2
8S2
AT45DB021E-SSHNHC-T 1,3
8S1
AT45DB021E-SHNHC-T 1,3
8S2
Package
Code
Description
8S1
8-lead 0.150" wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8S2
8-lead 0.208" wide, Plastic Gull Wing Small Outline (EIAJ SOIC)
8MA1
8-pad (5 x 6 x 0.6 mm body), Thermally Enhanced Plastic Ultra Thin Dual Flat No-lead (UDFN)



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