DA14531MOD

Final

Datasheet

Revision 3.1

31-May-2021

CFR0011-120-00

23 of 32

© 2021-2021 Dialog Semiconductor

Solderability reflow check of 5 cycles was performed, applying the procedures mentioned in JESD-

A113E standard.

The MSL is an indicator for the maximum allowable time period (floor life time) in which a moisture

sensitive plastic device, once removed from the dry bag, can be exposed to an environment with a

maximum temperature of 30°C and a maximum relative humidity of 60 % RH before the solder reflow

process.

DA14531 TINY Module is qualified for MSL 3.

Table 12: MSL Level vs Floor Life Time

MSL Level

Floor Life Time

MSL 4

72 hours

MSL 3

168 hours

MSL 2A

4 weeks

MSL 2

1 year

MSL 1

Unlimited at 30°C/85%RH

10 Ordering Information

The ordering number consists of the part number followed by a suffix that indicates the packing

method. For details and availability, please consult your Dialog Semiconductor local sales

representative.

Table 13: Ordering Information (Samples)

Part Number

Size (mm)

Shipment Form

Pack Quantity

MOQ

DA14531MOD-00F0100C

12.5 x 14.5 x 2.8

Reel

100

3

Table 14: Ordering Information (Production)

Part Number

Size (mm)

Shipment Form

Pack Quantity

MOQ

DA14531MOD-00F01002

12.5 x 14.5 x 2.8

Reel

1000

1

11 Regulatory Information

certified for a global market. This facilitates the user end-product market entry. Please note that the

end-product would need to apply for the end-product certification, however the module certification

listed below will facilitate that procedure.

When the end user sends the end-product to those markets, the end-product may need to follow

additional requirements according to the specific market regulation.

For example, some markets have additional testing and/or certification like Korea EMC, South Africa

SABS EMC and some have the requirement to put on the end-product label a modular approval ID or

Japan, Taiwan, Brazil.