4X 0.52 mm critical area on aperture

Window

Window

Array

Figure 6-1. Illumination Overfill Diagram - Critical Area

6.5 Thermal Information

THERMAL METRIC(1)

DLP300S

UNIT

FQK (LGA)

57 PINS

Thermal resistance

Active area to test point 1 (TP1)(1)

5.4

°C/W

(1)

The DMD is designed to conduct absorbed and dissipated heat to the back of the package. The cooling system must be capable of

maintaining the package within the temperature range specified in the Section 6.4. The total heat load on the DMD is largely driven by

the incident light absorbed by the active area although other contributions include light energy absorbed by the window aperture and

electrical power dissipation of the array. Optical systems should be designed to minimize the light energy falling outside the window

clear aperture since any additional thermal load in this area can significantly degrade the reliability of the device.

6.6 Electrical Characteristics

Over operating free-air temperature range (unless otherwise noted)(10)

PARAMETER

TEST CONDITIONS(2)

MIN

TYP

MAX

UNIT

CURRENT

Supply current: VDD(3) (5)

VDD = 1.95 V

60.5

mA

VDD = 1.8 V

54

Supply current: VDDI(3) (5)

VDDI = 1.95 V

16.5

mA

VDD = 1.8 V

11.3

Supply current: VOFFSET(4) (6)

VOFFSET = 10.5 V

2.2

mA

VOFFSET = 10 V

1.5

Supply current: VBIAS(4) (6)

VBIAS = 18.5 V

0.6

mA

VBIAS = 18 V

0.3

Supply current: VRESET(6)

VRESET = –14.5 V

2.4

mA

VRESET = –14 V

1.7

POWER(1)

Supply power dissipation: VDD(3) (5)

VDD = 1.95 V

118

mW

VDD = 1.8 V

95

Supply power dissipation: VDDI(3) (5)

VDDI = 1.95 V

32

mW

VDD = 1.8 V

20

Supply power dissipation:

VOFFSET(4) (6)

VOFFSET = 10.5 V

23

mW

VOFFSET = 10 V

15

Supply power dissipation: VBIAS(4) (6)

VBIAS = 18.5 V

11

mW

VBIAS = 18 V

6

Supply power dissipation: VRESET(6)

VRESET = –14.5 V

35

mW

VRESET = –14 V

24

Supply power dissipation: Total

160

219

mW

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DLP300S

DLPS214A – JULY 2021 – REVISED AUGUST 2021

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