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SL900A Datasheet(PDF) 5 Page - ams AG |
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SL900A Datasheet(HTML) 5 Page - ams AG |
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5 / 103 page  ams Datasheet Page 5 [v1-12] 2018-Oct-29 Document Feedback SL900A − Bare Die Pads Layout Figure 6: RF Pad Window (applicable to ANT1 and ANT2 pads) • RF pads have only top metal layers connected to ANT1 and ANT2. • An additional polysilicon shield is connected to the substrate supply ring (VSS). • Overlap of metal over passivation opening is 7 μm. • Overlap of polysilicon shield over Metal is 2.8 μm. Figure 7: Pad Window (applicable to all pads except ANT1 and ANT2) • Regular bonding pads have all metal layers connected, no other different layers except metal underneath the pads. • Overlap of all Metal layers over passivation opening is 5 μm. W id th _y Width_x RF Pad Window – applicable to ANT pads W id th _y Width_x |
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