| Electronic Components Datasheet Search |
|
AS3933 Datasheet(PDF) 8 Page - ams AG |
|
|
|||||||||||||||||||||||||||||
AS3933 Datasheet(HTML) 8 Page - ams AG |
|
8 / 64 page ![]() ams Datasheet Page 7 [v1-08] 2015-Sep-02 Document Feedback AS3933 − Pin Assignments Dice On Wafer DoW Attributes: • Wafer Diameter: 8” • Process: 0.35μm • Wafer Thickness: 725μm ± 15μm • Scribe line: 80μm • Chip Size: 2.070 x 1.700 mm • Pad Size: 85 x 85 μm Figure 9: DoW Pad Assignment |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |