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RT600 Datasheet(PDF) 166 Page - NXP Semiconductors

Part # RT600
Description  Dual-core microcontroller with 32-bit Cortex짰-M33 and Xtensa HiFi4 Audio DSP CPUs; Up to 4.5 MB SRAM; FlexSPI with cache and dynamic decryption; High-speed USB device/host Phy; 12-bit 1 Msamples/s ADC; Analog Comparator; Audio
PDF  167 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

RT600 Datasheet(HTML) 166 Page - NXP Semiconductors

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design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit
for the customer’s applications and products planned, as well as for the planned application and use of customer’s
third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks
associated with their applications and products.
NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on
any weakness or default in the customer’s applications or products, or the application or use by customer’s third party
customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using
NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or
use by customer’s third party customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of
IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation
of the device at these or any other conditions above those given in the Recommended operating conditions section (if
present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting
values will permanently and irreversibly affect the quality and reliability of the device.
Terms and conditions of commerical sale — NXP Semiconductors products are sold subject to the general terms
and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a
valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the
respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general
terms and conditions with regard to the purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that
is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other
industrial or intellectual property rights.
Hazardous voltage — Although basic supply voltages of the product may be much lower, circuit voltages up to 60 V
may appear when operating this product, depending on settings and application. Customers incorporating or otherwise
using these products in applications where such high voltages may appear during operation, assembly, test etc. of such
application, do so at their own risk. Customers agree to fully indemnify NXP Semiconductors for any damages resulting
from or in connection with such high voltages. Furthermore, customers are drawn to safety standards (IEC 950, EN 60
950, CENELEC, ISO, etc.) and other (legal) requirements applying to such high voltages.
Bare die — All die are tested on compliance with their related technical specifications as stated in this data sheet up
to the point of wafer sawing and are handled in accordance with the NXP Semiconductors storage and transportation
conditions. If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. There are
no post-packing tests performed on individual die or wafers.
NXP Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die.
Accordingly, NXP Semiconductors assumes no liability for device functionality or performance of the die or systems
after third party sawing, handling, packing or assembly of the die. It is the responsibility of the customer to test and
qualify their application in which the die is used. All die sales are conditioned upon and subject to the customer entering
into a written die sale agreement with NXP Semiconductors through its legal department.
Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
Export control — This document as well as the item(s) described herein may be subject to export control regulations.
Export might require a prior authorization from competent authorities.
Evaluation products —This product is provided on an “as is” and “with all faults” basis for evaluation purposes only.
NXP Semiconductors, its affiliates and their suppliers expressly disclaim all warranties, whether express, implied or
statutory, including but not limited to the implied warranties of non-infringement, merchantability and fitness for a
particular purpose. The entire risk as to the quality, or arising out of the use or performance, of this product remains with
customer. In no event shall NXP Semiconductors, its affiliates or their suppliers be liable to customer for any special,
indirect, consequential, punitive or incidental damages (including without limitation damages for loss of business,
business interruption, loss of use, loss of data or information, and the like) arising out the use of or inability to use the
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