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ADM3058EBRIZ Datasheet(PDF) 8 Page - Analog Devices |
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ADM3058EBRIZ Datasheet(HTML) 8 Page - Analog Devices |
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8 / 18 page ![]() ADM3058E Data Sheet Rev. A | Page 8 of 18 ABSOLUTE MAXIMUM RATINGS Pin voltages with respect to GND1/GND2 are on same side, unless otherwise noted. Table 7. Parameter Rating VDD1, VDD2 −0.5 V to +6 V Logic Side Input and Output: TXD, RXD −0.5 V to VDD1 + 0.5 V CANH, CANL −40 V to +40 V Temperature Industrial Operating Range −40°C to +125°C Storage Range −65°C to +150°C Maximum Junction (TJ) 150°C Moisture Sensitivity Level (MSL) 3 Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL RESISTANCE Thermal performance is directly linked to PCB design and operating environment. Careful attention to PCB thermal design is required. θJA is the natural junction to ambient thermal resistance measured in a one cubic foot sealed enclosure. Table 8. Thermal Resistance Package Type1 θJA Unit RI-8-1 97 °C/W 1 The thermocouple is located at the center of the package underside, and the test was conducted on a 4-layer board with thin traces. See the Thermal Analysis section for the thermal model definitions. ELECTROSTATIC DISCHARGE (ESD) RATINGS The following ESD information is provided for handling of ESD sensitive devices in an ESD protected area only. Human body model (HBM) per ANSI/ESDA/JEDEC JS-001. International Electrotechnical Commission (IEC) electromagnetic compatibility: Part 4-2 (IEC) per IEC 61000-4-2. ESD Ratings for ADM3058E Table 9. ADM3058E, 8-Lead SOIC_IC ESD Model Withstand Threshold (V) Class HBM1 ±4 kV 3A IEC2 ±8 kV (across isolation barrier with respect to GND1 Level 4 IEC3 ±8 kV (contact discharge with respect to GND2) Level 4 ±15 kV (air discharge with respect to GND2 Level 4 1 All pins, 1.5 kΩ, 100 pF. 2 Across the isolation barrier, GND2 to GND1. 3 CANH/CANL. ESD CAUTION Table 10. Maximum Continuous Working Voltage1 Parameter Insulation Rating (20-Year Lifetime)2 VDE 0884-11 Lifetime Conditions Fulfilled AC Voltage Bipolar Waveform Reinforced Insulation 1060 V peak Lifetime limited by insulation lifetime per VDE-0884-11 DC Voltage Basic Insulation 1660 V peak Lifetime limited by package creepage per IEC 60664-1 Reinforced Insulation 830 V peak Lifetime limited by package creepage per IEC 60664-1 1 The maximum continuous working voltage refers to the continuous voltage magnitude imposed across the isolation barrier. See the Insulation Lifetime section for more details. 2 Insulation capability without regard to creepage limitations. Working voltage may be limited by the PCB creepage when considering rms voltages for components soldered to a PCB (assumes Material Group I up to 1250 V rms), or by the SOIC_IC package creepage of 8.3 mm, when considering rms voltages for Material Group II. |
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