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ADM3058EBRIZ Datasheet(PDF) 8 Page - Analog Devices

Part # ADM3058EBRIZ
Description  5.7 kV rms, Signal Isolated, High Working Voltage, CAN FD Transceiver with 짹15kV IEC ESD
PDF  18 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADM3058EBRIZ Datasheet(HTML) 8 Page - Analog Devices

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ADM3058E
Data Sheet
Rev. A | Page 8 of 18
ABSOLUTE MAXIMUM RATINGS
Pin voltages with respect to GND1/GND2 are on same side,
unless otherwise noted.
Table 7.
Parameter
Rating
VDD1, VDD2
−0.5 V to +6 V
Logic Side Input and Output: TXD, RXD
−0.5 V to VDD1 + 0.5 V
CANH, CANL
−40 V to +40 V
Temperature
Industrial Operating Range
−40°C to +125°C
Storage Range
−65°C to +150°C
Maximum Junction (TJ)
150°C
Moisture Sensitivity Level (MSL)
3
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to PCB design and
operating environment. Careful attention to PCB thermal
design is required.
θJA is the natural junction to ambient thermal resistance
measured in a one cubic foot sealed enclosure.
Table 8. Thermal Resistance
Package Type1
θJA
Unit
RI-8-1
97
°C/W
1 The thermocouple is located at the center of the package underside, and the
test was conducted on a 4-layer board with thin traces. See the Thermal
Analysis section for the thermal model definitions.
ELECTROSTATIC DISCHARGE (ESD) RATINGS
The following ESD information is provided for handling of
ESD sensitive devices in an ESD protected area only.
Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.
International Electrotechnical Commission (IEC) electromagnetic
compatibility: Part 4-2 (IEC) per IEC 61000-4-2.
ESD Ratings for ADM3058E
Table 9. ADM3058E, 8-Lead SOIC_IC
ESD Model
Withstand Threshold (V)
Class
HBM1
±4 kV
3A
IEC2
±8 kV (across isolation barrier with
respect to GND1
Level 4
IEC3
±8 kV (contact discharge with respect to
GND2)
Level 4
±15 kV (air discharge with respect to
GND2
Level 4
1 All pins, 1.5 kΩ, 100 pF.
2 Across the isolation barrier, GND2 to GND1.
3 CANH/CANL.
ESD CAUTION
Table 10. Maximum Continuous Working Voltage1
Parameter
Insulation Rating (20-Year Lifetime)2
VDE 0884-11 Lifetime Conditions Fulfilled
AC Voltage
Bipolar Waveform
Reinforced Insulation
1060 V peak
Lifetime limited by insulation lifetime per VDE-0884-11
DC Voltage
Basic Insulation
1660 V peak
Lifetime limited by package creepage per IEC 60664-1
Reinforced Insulation
830 V peak
Lifetime limited by package creepage per IEC 60664-1
1 The maximum continuous working voltage refers to the continuous voltage magnitude imposed across the isolation barrier. See the Insulation Lifetime section for
more details.
2 Insulation capability without regard to creepage limitations. Working voltage may be limited by the PCB creepage when considering rms voltages for components
soldered to a PCB (assumes Material Group I up to 1250 V rms), or by the SOIC_IC package creepage of 8.3 mm, when considering rms voltages for Material Group II.



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