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ADM3058EBRIZ Datasheet(PDF) 16 Page - Analog Devices |
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ADM3058EBRIZ Datasheet(HTML) 16 Page - Analog Devices |
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16 / 18 page ![]() ADM3058E Data Sheet Rev. A | Page 16 of 18 APPLICATIONS INFORMATION RADIATED EMISSIONS AND PCB LAYOUT The ADM3058E isolated CAN transceivers with integrated dc-to-dc converters pass EN 55022, Class B by 6 dB on a simple 2-layer PCB design. Neither stitching capacitance nor high voltage surface-mount technology (SMT) safety capacitors are required to meet this emission level. PCB LAYOUT The ADM3058E isolated CAN transceiver requires no external interface circuitry for the logic interfaces. Power supply bypassing is required at the logic input supply (VDD1), and the shared CAN transceiver and digital isolator supply pin (VDD2). The recommended bypass capacitor value is 0.1 μF. Note that low effective series resistance (ESR) bypass capacitors are required and must be placed as close to the chip pads as possible. The total lead length between both ends of the capacitor and the input power supply pin must not exceed 10 mm. In applications involving high common-mode transients, minimize board coupling across the isolation barrier. Design the board layout so that any coupling that does occur equally affects all pins on a given component side. Failure to ensure this equal coupling can cause voltage differences between pins exceeding the absolute maximum ratings of the device, thereby leading to latch-up or permanent damage. 0.1µF 0.1µF 1 TXD 2 RXD 3 GND1 4 VDD1 VDD2 8 CANH 7 CANL 6 GND2 5 ADM3058E Figure 22. Recommended PCB Layout THERMAL ANALYSIS The ADM3058E device consists of three internal die attached to a split lead frame. For the purposes of thermal analysis, the die are treated as a thermal unit, with the highest junction temperature reflected in the θJA value from Table 8. The θJA value is based on measurements taken with the devices mounted on a JEDEC standard, 4-layer board with fine width traces and still air. INSULATION LIFETIME All insulation structures eventually break down when subjected to voltage stress over a sufficiently long period of time. The rate of insulation degradation is dependent on the characteristics of the voltage waveform applied across the insulation as well as on the materials and material interfaces. The two types of insulation degradation of primary interest are breakdown along surfaces exposed to air and insulation wear out. Surface breakdown is the phenomenon of surface tracking and is the primary determinant of surface creepage requirements in system level standards. Insulation wear out is the phenomenon where charge injection or displacement currents inside the insulation material cause long-term insulation degradation. SURFACE TRACKING Surface tracking is addressed in electrical safety standards by setting a minimum surface creepage based on the working voltage, the environmental conditions, and the properties of the insulation material. Safety agencies perform characterization testing on the surface insulation of components, allowing the components to be categorized in different material groups. Lower material group ratings are more resistant to surface tracking and can therefore provide adequate lifetime with smaller creepage. The minimum creepage for a given working voltage and material group is in each system level standard and is based on the total rms voltage across the isolation, pollution degree, and material group. The material group and creepage for the ADM3058E isolator is listed in Table 3 for the 8-lead, wide body SOIC package. INSULATION WEAR OUT The lifetime of insulation caused by wear out is determined by its thickness, material properties, and the voltage stress applied. It is important to verify that the product lifetime is adequate at the application working voltage. The working voltage supported by an isolator for wear out may not be the same as the working voltage supported for tracking. The working voltage applicable to tracking is specified in most standards. Testing and modeling have shown that the primary driver of long-term degradation is displacement current in the polyimide insulation causing incremental damage. The stress on the insulation can be broken down into broad categories, such as dc stress, which causes little wear out because there is no displacement current, and an ac component time varying voltage stress, which causes wear out. The ratings in certification documents are usually based on 60 Hz sinusoidal stress because this reflects isolation from line voltage. Many practical applications have combinations of 60 Hz ac and dc across the barrier, as shown in Equation 1. Because only the ac portion of the stress causes wear out, the equation can be rearranged to solve for the ac rms voltage, as shown in Equation 2. For insulation wear out with the polyimide materials used in this product, the ac rms voltage determines the product lifetime. 22 RMS AC RMS DC VV V (1) or 2 2 DC RMS RMS AC V V V (2) where: VRMS is the total rms working voltage. VAC RMS is the time varying portion of the working voltage. VDC is the dc offset of the working voltage. |
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