LTM4650 datasheet(29/38 Pages) AD

29 / 38 page

LTM4652

Rev. 0

For more information www.analog.com

APPLICATIONS INFORMATION

Table 2. 1.0V Output

DERATING CURVE

VIN (V)

POWER LOSS CURVE

AIRFLOW (LFM)

HEAT SINK

θJA (°C/W)

Figure 18, Figure 19

5, 12

Figure 15

None

8.0

Figure 18, Figure 19

5, 12

Figure 15

200

None

6.6

Figure 18, Figure 19

5, 12

Figure 15

400

None

5.6

Figure 20, Figure 21

5, 12

Figure 15

BGA Heat Sink

7.6

Figure 20, Figure 21

5, 12

Figure 15

200

BGA Heat Sink

5.9

Figure 20, Figure 21

5, 12

Figure 15

400

BGA Heat Sink

5.0

Table 3. 1.8V Output

DERATING CURVE

VIN (V)

POWER LOSS CURVE

AIRFLOW (LFM)

HEAT SINK

θJA (°C/W)

Figure 22, Figure 23

5, 12

Figure 16

None

8.0

Figure 22, Figure 23

5, 12

Figure 16

200

None

6.3

Figure 22, Figure 23

5, 12

Figure 16

400

None

5.3

Figure 24, Figure 25

5, 12

Figure 16

BGA Heat Sink

7.6

Figure 24, Figure 25

5, 12

Figure 16

200

BGA Heat Sink

5.5

Figure 24, Figure 25

5, 12

Figure 16

400

BGA Heat Sink

4.6

Table 4. 3.3V Output

DERATING CURVE

VIN (V)

POWER LOSS CURVE

AIRFLOW (LFM)

HEAT SINK

θJA (°C/W)

Figure 26, Figure 27

5, 12

Figure 17

None

7.9

Figure 26, Figure 27

5, 12

Figure 17

200

None

6.0

Figure 26, Figure 27

5, 12

Figure 17

400

None

5.1

Figure 28, Figure 29

5, 12

Figure 17

BGA Heat Sink

7.6

Figure 28, Figure 29

5, 12

Figure 17

200

BGA Heat Sink

5.4

Figure 28, Figure 29

5, 12

Figure 17

400

BGA Heat Sink

4.2

Table 5. Heat Sink and Thermally Conductive Adhesive Tape Part Numbers

MANUFACTURER

DEVICE

PART NUMBER

WEBSITE

Boyd Corp.

Heat Sink

375424B00034G

www.boydcorp.com

Chomerics

Tape

T411

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